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SEP8MA8001

Description
Triple Color LED, Red/green/blue, White, 13.3mm, 13.70 X 5.23 MM, LEAD FREE, SURFACE MOUNT PACKAGE-16
CategoryLED optoelectronic/LED    photoelectric   
File Size492KB,14 Pages
ManufacturerAllegro
Websitehttp://www.allegromicro.com/
Environmental Compliance
Download Datasheet Parametric View All

SEP8MA8001 Overview

Triple Color LED, Red/green/blue, White, 13.3mm, 13.70 X 5.23 MM, LEAD FREE, SURFACE MOUNT PACKAGE-16

SEP8MA8001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAllegro
package instruction13.70 X 5.23 MM, LEAD FREE, SURFACE MOUNT PACKAGE-16
Reach Compliance Codecompliant
colorRED/GREEN/BLUE
ConfigurationSEPARATE, 8 ELEMENTS
Maximum forward current0.04 A
Maximum forward voltage3.9 V
JESD-609 codee4
Lens typeWHITE
Installation featuresSURFACE MOUNT
Number of functions1
Number of LEDs in the array8
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Optoelectronic device typesTRIPLE COLOR LED
total height2.5 mm
method of packingTAPE AND REEL
shapeRECTANGULAR
size13.3 mm
surface mountYES
Terminal surfaceSilver (Ag)
Terminal pitch8.305 mm
SEPM Series
RGB Multi Chip LED Modules
Features and Benefits
High efficiency, 50 1m/W with all LEDs illuminated;
equivalent to CCFLs
Low thermal resistance, R
θJC
= 6°C/W
High optical output, 25 lm, with all LEDs illuminated
Superior directivity
5.23 mm × 13.7 mm case footprint, and
low 2.5-mm overall package height
Silver-plated leadframe
LED array of 8 RGB chips
Description
The SEPM series of LEDs provides a range of high-powered
AlGaInP red (λ
D
= 616 nm), and InGaN green (523 nm) and
blue (461 nm) LEDs that can be used in general lighting
applications, amusement and gaming equipment, and for
backlighting TFT displays. Each module combines 8 LED
chips in 4 separate channels.
Modular design allows the SEPM devices to be easily assembled
into string arrays by simply connecting the modules in series.
The devices also provide superior color balance throughout
the display because of the high density of LEDs that can be
achieved. This also minimizes the distance that power and
control lines must run between LEDs and from the LEDs to
the control electronics.
The white thermoplastic case is an innovative Sanken original
design with exceptional heat dissipation properties. The white
resin compound is especially formulated for superior reflectance
and transmittance of the generated light. Enhanced thermal
dissipation is achieved through the incorporated heatsink on the
bottom of the package. The heatsink can be mated directly to an
external radiator through the PCB for superior heat conduction
allowing dense placement of modules.
The leadframe is plated with silver, providing a highly-reflective
surface for the bottom and sides of the emitting area. The
terminals and heatsink are also silver-plated.
Package:
16-pin, 1.27-mm pitch, surface mount
Not to scale
V
B
5 to 20 V
L1
10
μH
Typical Application
D1
C
O
2.2
μF/50
V
8 SEPM modules, 8 LEDs each
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
5V
1
μF
36 V SW SW OVP
LED1
SEL1
SEL2
LED2
SEL3
Allegro
VIN
A8500 LED3
0.1
μF
LED Driver
10 V
IC
LED4
EN
PWM
APWM
LED5
SKIP
COMP
LED6
FSET
ISET
LED7
AGND PGND LED8
The SEPM devices can be mounted in tight
arrays on a single PCB substrate for ease of
manufacture and to provide a dense, uniform
appearance when illuminated.
The application shown here uses eight
SEP8Mx LED modules, each populated by
eight LEDs connected in series. Different
combinations of LEDs can be placed in the
modules
48101.001, Rev. 3

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