Philips Semiconductors
Product specification
High-voltage car ignition diode
FEATURES
•
Plastic package
•
Glass passivated
•
High maximum operating temperature
•
Low leakage current
•
Excellent stability
•
Guaranteed avalanche energy absorption capability.
APPLICATIONS
•
Car ignition systems
•
Automotive applications with extreme temperature
requirements.
Cathode indicated by a green band.
k
BYX135GPL
DESCRIPTION
Plastic package, using glass passivation and a high
temperature alloyed construction.
This package is hermetically sealed and fatigue free as
coefficients of expansion of all used parts are matched.
The package is designed to be used in an insulating
medium such as resin, oil or SF6 gas.
a
MBL155
Fig.1 Simplified outline (SOD125A) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
V
RRM
V
RWM
I
F(AV)
I
FRM
I
RSM
T
stg
T
j
PARAMETER
repetitive peak reverse voltage
crest working reverse voltage
average forward current
repetitive peak forward current
non-repetitive peak reverse current
storage temperature
junction temperature
continuous
t = 100
µs
triangular pulse;
T
j(max)
prior to surge
CONDITIONS
MIN.
−
−
−
−
−
−65
−
MAX.
5
5
50
500
50
+175
175
UNIT
kV
kV
mA
mA
mA
°C
°C
CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
V
F
V
(BR)R
I
R
PARAMETER
forward voltage
reverse avalanche breakdown voltage
reverse current
CONDITIONS
I
F
= 10 mA
I
R
= 100
µA
V
R
= V
RWMmax
; T
j
= 175
°C
MIN.
6.25
7.0
−
MAX.
8.75
9.5
30
UNIT
V
kV
µA
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
PARAMETER
CONDITIONS
VALUE
90
UNIT
K/W
thermal resistance from junction to ambient T
amb
= T
leads
; lead length = 10 mm
2001 Oct 02
2
Philips Semiconductors
Product specification
High-voltage car ignition diode
DATA SHEET STATUS
DATA SHEET STATUS
(1)
Objective data
PRODUCT
STATUS
(2)
Development
DEFINITIONS
BYX135GPL
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 Oct 02
4
Power technology
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