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UPD23C16303F9-XXX-BC3

Description
MASK ROM, 1MX16, 90ns, CMOS, PBGA48, 8 X 6 MM, FBGA-48
Categorystorage    storage   
File Size99KB,16 Pages
ManufacturerNEC Electronics
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UPD23C16303F9-XXX-BC3 Overview

MASK ROM, 1MX16, 90ns, CMOS, PBGA48, 8 X 6 MM, FBGA-48

UPD23C16303F9-XXX-BC3 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerNEC Electronics
Parts packaging codeBGA
package instructionTFBGA,
Contacts48
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time90 ns
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length8 mm
memory density16777216 bit
Memory IC TypeMASK ROM
memory width16
Number of functions1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature-10 °C
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width6 mm
PRELIMINARY DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD23C16303
16M-BIT MASK-PROGRAMMABLE ROM
1M-WORD BY 16-BIT
Description
The
µ
PD23C16303 is a 16,777,216 bits mask-programmable ROM. The word organization is 1,048,576 words by 16 bits.
The active levels of OE (Output Enable Input) can be selected with mask-option.
The
µ
PD23C16303 is packed in 48-pin PLASTIC TSOP(I) and 48-pin TAPE FBGA.
Features
Pin compatible with NOR Flash Memory
Word organization
1,048,576 words by 16 bits
Operating supply voltage : V
CC
= 2.7 V to 3.6 V
Input / output supply voltage : V
CC
Q = 1.65 V to 1.95 V
Operating supply voltage
V
CC
3.3 V
±
0.3 V
3.0 V
±
0.3 V
Access time
ns (MAX.)
85
90
Power supply current (Active mode)
mA (MAX.)
30
Standby current (CMOS level input)
µ
A (MAX.)
30
Ordering Information
Part Number
Package
48-pin PLASTIC TSOP(I) (12 x 20) (Normal bent)
48-pin TAPE FBGA (8 x 6)
µ
PD23C16303GZ-xxx-MJH
µ
PD23C16303F9-xxx-BC3
(xxx : ROM code suffix No.)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M15706EJ1V0DS00 (1st edition)
Date Published October 2001 NS CP(K)
Printed in Japan
©
2001

UPD23C16303F9-XXX-BC3 Related Products

UPD23C16303F9-XXX-BC3 UPD23C16303GZ-XXX-MJH
Description MASK ROM, 1MX16, 90ns, CMOS, PBGA48, 8 X 6 MM, FBGA-48 MASK ROM, 1MX16, 90ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Parts packaging code BGA TSOP1
package instruction TFBGA, TSOP1,
Contacts 48 48
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Maximum access time 90 ns 90 ns
JESD-30 code R-PBGA-B48 R-PDSO-G48
JESD-609 code e0 e0
length 8 mm 18.4 mm
memory density 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
memory width 16 16
Number of functions 1 1
Number of terminals 48 48
word count 1048576 words 1048576 words
character code 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
Minimum operating temperature -10 °C -10 °C
organize 1MX16 1MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TSOP1
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form BALL GULL WING
Terminal pitch 0.8 mm 0.5 mm
Terminal location BOTTOM DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 6 mm 12 mm
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