L6116IMB12 datasheet, PDF - EEWORLD Datasheet

L6116IMB12: DescriptionStandard SRAM, 2KX8, 12ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24; Categorystorage storage; File Size767KB，7 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L6116IMB12 Overview

Standard SRAM, 2KX8, 12ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Objectid	1400767533
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
compound_id	9847718
Maximum access time	12 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.75 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.08 mm
Maximum standby current	0.00015 A
Minimum standby current	2 V
Maximum slew rate	0.195 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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