DATA SHEET
FEATURES
QTVAXX0NXXXSMTF
APPLICATIONS
•
Point to Point Radios
•
Phased Array Radar
•
High Frequency Transceivers
•
Up/Down Converters
•
Software Defined Radios
REV 07/28/2010
•
36 – 50 GHz
•
Surface Mount for Pick and Place Assembly
•
1206 Small Footprint
•
RoHS Compliant Versions
•
Available on Tape & Reel
•
Same Footprint, Fixed Versions Available
GENERAL DESCRIPTION
The QTVA is a one of a kind, temperature variable high frequency surface mount device developed for applications where
specific signal level control is required. Being passive in nature, there is no distortion, phase shift or time delay. The
attenuator structure is internally tuned for optimum performance beyond Ka band, with the added benefit of being a truly
symmetrical, bidirectional attenuator. The QTVA comes in two styles, microstrip and coplanar.
ELECTRICAL SPECIFICATIONS
(1)
QTVAXXXNXXXSMTF
Frequency
GHz
36 – 50
Impedance
Ω
50
Attenuation
dB
0, 3 – 10
Attenuation
Accuracy
dB
± 0.5
Temperature
Coefficient
(2)
10
-3
dB/dB/°C
3, 5, 7
Temperature
Coefficient
Tolerance
10
-3
dB/dB/°C
±1
Power
Handling
(3)
mWatts CW
200
VSWR
Max
1.50
Operating
Temperature
°C
-55 to +150
Specification Notes:
(1) Measured on EMC Technology test fixture. Specifications are subject to change without notice.
(2) TCA = (LINEAR REGRESSION SLOPE) / (ATTENUATION @ 25°C).
Calculate linear regression slope from attenuation versus temperature from -55°C to +125°C in 20°C increment.
(3) Full rated power to 125°C, derated linearly to 0 Watts at 150°C
PART NUMBERING
emc-rflabs.com • +1 772-286-9300
AS 9100, ISO 9001 and ISO 14001 Certified
DATA SHEET
QTVAXX0NXXXSMTF
REV 07/28/2010
TYPICAL PERFORMANCE
QTVA060NXXMSMTF*
* simulation data at 25°C
QTVAXXXXNXXCSMTF
2
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AS 9100, ISO 9001 and ISO 14001 Certified
DATA SHEET
QTVAXX0NXXXSMTF
REV 07/28/2010
QTVAXX0NXXMSMTF PIN DESIGNATION / MECHANICAL SPECIFICATION
TOP SIDE
0.120 [3.05]
0.010 [0.25]
0.009 0.22
0.006 0.15
BOTTOM SIDE
[ ]
0.010 [0.25]
0.020 [0.51]
0.010 [0.25]
0.065 [1.65]
0.005 [0.13]
MECHANICAL SPECIFICATION
Substrate
Resistive Element
Encapsulant
Termination
Termination Finish
96% Alumina
Thick Film
Silicon Polymer
Gold
Silver .0003 - .0006
Nickel .0001 - .0003
MOUNTING FOR QTVAXX0NXXMSMTF
0.024 [0.61]
5X Ø0.012 [Ø0.30]
PLATED THRU HOLES
50 Ohm Line
0.063 [1.60]
0.020 [0.51]
0.038 [0.96]
0.025 [0.64]
MOUNTING
CROSS-SECTION VIEW
3
emc-rflabs.com • +1 772-286-9300
AS 9100, ISO 9001 and ISO 14001 Certified
DATA SHEET
QTVAXX0NXXXSMTF
REV 07/28/2010
QTVAXX0NXXCSMTF PIN DESIGNATION / MECHANICAL SPECIFICATION
BOTTOM SIDE
INPUT/OUTPUT
TOP SIDE
XX
PROTECTIVE COATING
TIE TO MICROSTRIP GROUND
BOTTOM SIDE
TOP SIDE
0.120 [3.05]
0.095 [2.41]
0.010 [0.25]
0.065 [1.65]
0.040 [1.02]
0.020 [0.51]
0.025 0.64
0.021 0.53
[ ]
XX
ATTENUATION VALUE
GROUND
0.095 [2.41]
0.013 [0.32]
0.010 [0.25]
MECHANICAL SPECIFICATION
Substrate
Resistive Element
Encapsulant
Termination
Termination Finish
96% Alumina
Thick Film
Silicon Polymer
Gold
Silver .0003 - .0006
Nickel .0001 - .0003
4
emc-rflabs.com • +1 772-286-9300
AS 9100, ISO 9001 and ISO 14001 Certified
DATA SHEET
QTVAXX0NXXXSMTF
REV 07/28/2010
MOUNTING FOR QTVAXX0NXXCSMTF
LAND PATTERN
0.020 [0.51]
0.010 [0.25]
0.013 [0.32]
0.003 [0.06]
0.025 [0.64]
0.020 [0.51]
Ø0.010 [Ø0.25]
0.095 [2.41]
FLIP CHIP MOUNTING
50OHM MICROSTRIP TRACE
DIELECTRIC
MICROSTRIP GROUND PLANE
GAP CREATED BY ETCHING LAND PATTERN
5
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AS 9100, ISO 9001 and ISO 14001 Certified
PCB Design
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