GS842Z36CB-166T datasheet, PDF

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GS842Z36CB-166T: DescriptionZBT SRAM, 128KX36, 7ns, CMOS, PBGA119, FPBGA-119; Categorystorage storage; File Size249KB，29 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS842Z36CB-166T Overview

ZBT SRAM, 128KX36, 7ns, CMOS, PBGA119, FPBGA-119

GS842Z36CB-166T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	BGA, BGA119,7X17,50
Contacts	119
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	7 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B119
length	22 mm
memory density	4718592 bit
Memory IC Type	ZBT SRAM
memory width	36
Number of functions	1
Number of terminals	119
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	1.99 mm
Maximum standby current	0.025 A
Minimum standby current	2.3 V
Maximum slew rate	0.16 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	14 mm

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GS842Z18CB/GS842Z36CB

119-Bump BGA

Commercial Temp

Industrial Temp

Features

• 256K x 18 and 128K x 36 configurations

• User configurable Pipeline and Flow Through mode

• NBT (No Bus Turn Around) functionality allows zero wait

read-write-read bus utilization

• Fully pin compatible with both pipelined and flow through

NtRAM™, NoBL™ and ZBT™ SRAMs

• Pin-compatible with 2Mb, 9Mb, and 18Mb devices

• 3.3 V +10%/–10% core power supply

• 2.5 V or 3.3 V I/O supply

• LBO pin for Linear or Interleave Burst mode

• Byte write operation (9-bit Bytes)

• 3 chip enable signals for easy depth expansion

• Clock Control, registered address, data, and control

• ZZ Pin for automatic power-down

• JEDEC-standard 119-bump BGA package

• RoHS-compliant package available

4Mb Pipelined and Flow Through

Synchronous NBT SRAMs

250 MHz–100 MHz

3.3 V V

2.5 V and 3.3 V V

DDQ

Because it is a synchronous device, address, data inputs, and

read/ write control inputs are captured on the rising edge of the

input clock. Burst order control (LBO) must be tied to a power

rail for proper operation. Asynchronous inputs include the

sleep mode enable (ZZ) and Output Enable. Output Enable can

be used to override the synchronous control of the output

drivers and turn the RAM's output drivers off at any time.

Write cycles are internally self-timed and initiated by the rising

edge of the clock input. This feature eliminates complex off-

chip write pulse generation required by asynchronous SRAMs

and simplifies input signal timing.

The GS842Z18/36CB may be configured by the user to operate

in Pipeline or Flow Through mode. Operating as a pipelined

synchronous device, in addition to the rising-edge-triggered

registers that capture input signals, the device incorporates a

rising-edge-triggered output register. For read cycles, pipelined

SRAM output data is temporarily stored by the edge triggered

output register during the access cycle and then released to the

output drivers at the next rising edge of clock.

The GS842Z18/36CB is implemented with GSI's high

performance CMOS technology and is available in a JEDEC-

standard 119-bump BGA package.

Functional Description

The GS842Z18/36CB is a 4Mbit Synchronous Static SRAM.

GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other

pipelined read/double late write or flow through read/single

late write SRAMs, allow utilization of all available bus

bandwidth by eliminating the need to insert deselect cycles

when the device is switched from read to write cycles.

Parameter Synopsis

Pipeline

3-1-1-1

Flow

Through

2-1-1-1

tCycle

–250

4.0 ns

2.5 ns

TBD

5.5 ns

TBD

–200

5.5 ns

3.0 ns

TBD

6.5 ns

TBD

–166

6.0 ns

3.5 ns

TBD

7.0 ns

TBD

–150

6.7 ns

3.8 ns

TBD

7.5 ns

TBD

–100

10 ns

4.5 ns

TBD

12 ns

TBD

Rev: 1.01 8/2011

1/29

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS842Z18CB/GS842Z36CB

Functional Details

Clocking

Deassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to

suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation.

Pipelined Mode Read and Write Operations

All inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle

read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device

activation is accomplished by asserting all three of the Chip Enable inputs (E

, E

and E

). Deassertion of any one of the Enable

inputs will deactivate the device.

Function

Read

Write Byte “a”

Write Byte “b”

Write Byte “c”

Write Byte “d”

Write all Bytes

Write Abort/NOP

Read operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted low, all three

chip enables (E1, E2, and E3) are active, the write enable input signal W is deasserted high, and ADV is asserted low. The address

presented to the address inputs is latched in to address register and presented to the memory core and control logic. The control

logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At

the next rising edge of clock the read data is allowed to propagate through the output register and onto the Output pins.

Write operation occurs when the RAM is selected, CKE is active and the write input is sampled low at the rising edge of clock. The

Byte Write Enable inputs (B

, B

and B

) determine which bytes will be written. All or none may be activated. A write cycle

with no Byte Write inputs active is a no-op cycle. The Pipelined NBT SRAM provides double late write functionality, matching the

write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At the first rising

edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is required at the

third rising edge of clock.

Flow through Mode Read and Write Operations

Operation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a read cycle and the use

of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after new

address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow

Through mode the read pipeline is one cycle shorter than in Pipeline mode.

Write operations are initiated in the same way as well, but differ in that the write pipeline is one cycle shorter as well, preserving

the ability to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a

double late write protocol, in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode,

address and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising

edge of clock.

Rev: 1.01 8/2011

5/29

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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