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QES SERIES - 66 WATT
DESCRIPTION
QES single output DC/DC converters provide up to
66 Watts of output power in an industry standard,
quarter-brick package. The QES converters feature
open-frame packaging, along with planar magnetics
and a high efficiency topology to provide maximum
useable power with minimal thermal constraints. The
QES is suited to telecom, networking, and industrial
applications, and is fully compatible with production
board washing processes.
FEATURES
• Industry Standard
Package
• 100°C Case Operation
• Optional Trim and
Enable
• Wide Range Input
Voltage
• 1500V Isolation
• Short Circuit Protection
Efficiency vs. Load (48V Input)
95
90
85
EFFICIENCY %
80
QES066ZE-ANT
75
QES075ZG-ANT
70
65
10
20
30
40
50
60
70
80
90
100
LOAD %
General
Turn-On Time
Remote Shutdown
Remote Shutdown Reference
Switching Frequency
Isolation
Input - Output
Input - Case
Output - Case
Temperature Coefficient
Case Temperature
Operating Range
Storage Range
Thermal Shutdown Range
Vibration, 3 Axes, 5 Min Each
MTBF
†
(Bellcore TR-NWT-000332)
Safety
Weight (Approx.)
Notes
†
TECHNICAL SPECIFICATIONS
Input
Voltage Range
24 VDC Nominal
48 VDC Nominal
Input Reverse Input Current
Output
Setpoint Accuracy
Line Regulation V
in
Min. - V
in
Max., I
out
Rated
Load Regulation I
out
Min. - I
out
Max., V
in
Nom.
Remote Sense Headroom
Minimum Output Current
Dynamic Regulation, Loadstep
Pk Deviation
Settling Time
Voltage Trim Range
Short Circuit And Overcurrent Protection
Short Circuit Current Limit
Current Limit Threshold Range, % of I
out
Rated
OVP Trip Range
UVP Trip Range
OVP/UVP Type
±1%
0.2% V
out
0.5% V
out
0.5 VDC
10 %, I
out
Rated
25% I
out
4% V
out
500
µs
±10%
Shutdown
200% I
out
110 - 140%
18 - 36 VDC
36 - 75 VDC
Shunt Diode
30 ms
Positive or Negative Logic
V
in
Negative
300 kHz
1500 VDC
1050 VDC
1050 VDC
±0.02%/°C
-40 To +100°C
-40 To +125°C
105 to 115°C
5 g, 10 - 55 Hz
2.5 X 10
6
hrs
UL, CUL, TUV
1.7 oz
MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load, unless otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully compatible with
commercial wave-soldering equipment.
Safety: Agency approvals may vary from model to model. Please consult factory
for specific model information.
Units are water-washable and fully compatible with commercial spray or immersion
post wave-solder washing equipment.
115 - 140% V
out
Nom.
70 - 90% V
out
Nom.
Latching
1
QES SERIES - 66 WATT
MODELS - (See the last page of this file for options.)
Vin
(Volts)
24
24
24
24
48
48
48
48
Vin Range
(Volts)
18 - 36
18 - 36
18 - 36
18 - 36
36 - 75
36 - 75
36 - 75
36 - 75
Iin Max.*
(Amps)
2.6
3.5
3.3
4.4
1.4
1.8
1.6
2.2
Vout
(Volts)
2.5
2.5
3.3
3.3
2.5
2.5
3.3
3.3
Iout Rated
(Amps)
15
20
15
20
15
20
15
20
Ripple & Noise
Pk-Pk (mV)
100
100
100
100
100
100
100
100
Efficiency
Typ. **
80%
80%
85%
85%
85%
83%
86%
86%
Model
QES038YD-A
†
QES050YD-A
†
QES050YE-A
QES066YE-A
†
QES038ZD-A
QES050ZD-A
QES050ZE-A
QES066ZE-A
† Denotes advanced product release. Consult factory for product availability.
* Maximum input current at minimum input voltage, maximum rated output power.
** At nominal Vin, rated output.
MECHANICAL DRAWING
-0.14"
(-3.6mm)
0
MOUNTING INSERTS
M3X0.5 THROUGH 2PL
2.010"
(51.1mm)
0.895"(22.7mm)
1
1.45"
(36.8mm)
2
3
4
5
6
7
8
0.600"(15.2mm)
0.450"(11.4mm)
0.300"(7.6mm)
0.150"(3.8mm)
0
-0.295"(-7.5mm)
-0.425"(-10.8mm)
-0.010"
(-0.3mm)
2.000"
(50.8mm)
BOTTOM VIEW
2.28"
(57.9mm)
DIA 0.040"
(1.0mm)
DIA 0.062"
(1.6mm)
0.18"(4.6mm)
0.50"
(12.7mm)
Thermal Impedance
Natural Convection
100 LFM
200 LFM
300 LFM
400 LFM
10.1
8.0
5.4
4.4
3.4
°C/W
°C/W
°C/W
°C/W
°C/W
Pin
1
2
3
4
5
6
7
8
Function
-V
in
Tolerances
Inches:
.XX ± 0.020
.XXX ± 0.010
Pin:
± 0.002
(Millimeters)
.X ± 0.5
.XX ± 0.25
± 0.05
On/Off
+V
in
-Sense
Trim
+Sense
+V
out
-V
out
Note:
Thermal impedance data is dependent on
many environmental factors. The exact
thermal performance should be validated for
specific application.
( Dimensions as listed unless otherwise
specified.)
2
OPTIONS
When ordering equipment options, use the following suffix information. Select the option(s) that
you prefer and add them to the model number. Example ordering options are located below the
options table.
OPTION
Negative Logic
Lucent Compatible Trim
Terminal Strip
Trim
Enable
Trim and Enable
Current Share
Headerless
SUFFIX
N
T
TS
1
2
3
4
Y
APPLICABLE SERIES
HAS, HBD, HBS, HES, LES, QBS,
QES, TES, TQD
HAS, HBD, HBS, HES, QBS, QES
XWS, XWD, XWT
IAS, LES
IAD, IAS, LES, SMS
IAS, LES
SMS
Encapsulated EWS, IWS, OWS
REMARKS
TTL “Low” Turns Module ON
TTL “High” Turns Module OFF
PIN LENGTH AND HEATSINK
OPTIONS
0.110” (2.8mm) Pin Length
0.150” (3.8mm) Pin Length
0.24” (6.1mm) Horizontal Heatsink
0.24” (6.1mm) Vertical Heatsink
0.45” (11.4mm) Horizontal
Heatsink
0.45” (11.4mm) Vertical Heatsink
0.95” (24.1mm) Horizontal
Heatsink
0.95” (24.1mm) Vertical Heatsink
8
9
1H
1V
2H
2V
3H
3V
All Units (Except SMS)
All Units (Except SMS)
All Units (Except DIP, SIP, and SM
Packages)
All Units (Except DIP, SIP, and SM
Packages)
All Units (Except DIP, SIP, and SM
Packages)
All Units (Except DIP, SIP, and SM
Packages)
All Units (Except DIP, SIP, and SM
Packages)
All Units (Except DIP, SIP, and SM
Packages)
Standard Pin Length is 0.180”
(4.6mm)
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Example Options:HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and
0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS
Power-One products are not authorized for use as critical components in life support systems,
equipment used in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS
The appearance of products, including safety agency certifications pictured on labels, may change depending on the
date manufactured. Specifications are subject to change without notice.
3
Embedded System
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