Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDFP10, CERPACK-10
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| Parts packaging code | DFP |
| package instruction | DFP, FL10,.24 |
| Contacts | 10 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| high side driver | NO |
| Input properties | STANDARD |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | S-GDFP-F10 |
| JESD-609 code | e0 |
| length | 6.12 mm |
| Number of functions | 1 |
| Number of terminals | 10 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | TOTEM-POLE |
| Nominal output peak current | 9 A |
| Output polarity | TRUE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL10,.24 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 4.5/18 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.032 mm |
| Maximum slew rate | 3 mA |
| Maximum supply voltage | 18 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Disconnect time | 0.08 µs |
| connection time | 0.08 µs |
| width | 6.12 mm |
| MIC4422AF | MIC4421AJB | MIC4421AF | MIC4422AJB | |
|---|---|---|---|---|
| Description | Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDFP10, CERPACK-10 | Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDIP8, CERDIP-8 | Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDFP10, CERPACK-10 | Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDIP8, CERDIP-8 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DFP | DIP | DFP | DIP |
| package instruction | DFP, FL10,.24 | DIP, DIP8,.3 | DFP, FL10,.24 | DIP, DIP8,.3 |
| Contacts | 10 | 8 | 10 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| high side driver | NO | NO | NO | NO |
| Input properties | STANDARD | STANDARD | STANDARD | STANDARD |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | S-GDFP-F10 | R-GDIP-T8 | S-GDFP-F10 | R-GDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| length | 6.12 mm | 9.652 mm | 6.12 mm | 9.652 mm |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 10 | 8 | 10 | 8 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE |
| Nominal output peak current | 9 A | 9 A | 9 A | 9 A |
| Output polarity | TRUE | INVERTED | INVERTED | TRUE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DIP | DFP | DIP |
| Encapsulate equivalent code | FL10,.24 | DIP8,.3 | FL10,.24 | DIP8,.3 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| Peak Reflow Temperature (Celsius) | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED |
| power supply | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.032 mm | 5.08 mm | 2.032 mm | 5.08 mm |
| Maximum slew rate | 3 mA | 3 mA | 3 mA | 3 mA |
| Maximum supply voltage | 18 V | 18 V | 18 V | 18 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO |
| technology | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Disconnect time | 0.08 µs | 0.08 µs | 0.08 µs | 0.08 µs |
| connection time | 0.08 µs | 0.08 µs | 0.08 µs | 0.08 µs |
| width | 6.12 mm | 7.62 mm | 6.12 mm | 7.62 mm |
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