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54FCT827CTEB

Description
CPACK-24, Tube
Categorylogic    logic   
File Size111KB,7 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

54FCT827CTEB Overview

CPACK-24, Tube

54FCT827CTEB Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeCPACK
package instructionQFF, FL24,.4
Contacts24
Manufacturer packaging codeCP24
Reach Compliance Codenot_compliant
Other featuresWITH OUTPUT ENABLE
Control typeENABLE LOW
seriesFCT
JESD-30 codeR-GDFP-F24
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.032 A
Humidity sensitivity level1
Number of digits10
Number of functions1
Number of ports2
Number of terminals24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeQFF
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)260
power supply5 V
Prop。Delay @ Nom-Sup5 ns
propagation delay (tpd)11 ns
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum seat height2.286 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width9.144 mm
IDT54/74FCT827AT/BT/CT
FAST CMOS 10-BIT BUFFER
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
FAST CMOS
10-BIT BUFFER
IDT54/74FCT827AT/BT/CT
FEATURES:
Low input and output leakage
≤1µ
A (max.)
CMOS power levels
True TTL input and output compatibility
V
OH
= 3.3V (typ.)
V
OL
= 0.3V (typ.)
Meets or exceeds JEDEC standard 18 specifications
Military product compliant to MIL-STD-883, Class B and DESC
listed (dual marked)
A, B, and C speed grades (-15mA I
OH
, 48mA I
OL
)
Power off disable outputs permit “live insertion”
Available in the following packages:
Industrial: SOIC, SSOP, QSOP, TSSOP
Military: CERDIP, LCC, CERPACK
DESCRIPTION:
The FCT827T is built using an advanced dual metal CMOS technology.
The FCT827T 10-bit bus drivers provide high-performance bus inter-
face buffering for wide data/address paths or buses carrying parity. The 10-
bit buffers have NAND-ed output enables for maximum control flexibility.
All of the FCT827T high-performance interface family are designed for
high-capacitance load drive capability, while providing low-capacitance
bus loading at both inputs and outputs. All inputs have clamp diodes to
ground and all outputs are designed for low-capacitance bus loading in
high-impedance state.
FUNCTIONAL BLOCK DIAGRAM
Y
0
Y
1
Y
2
Y
3
Y
4
Y
5
Y
6
Y
7
Y
8
Y
9
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
OE
1
OE
2
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
1
c
1999 Integrated Device Technology, Inc.
AUGUST 2000
DSC-5484/-

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