DPS128X16A3-10M datasheet, PDF

DPS128X16A3-10M: DescriptionSRAM Module, 256KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50; Categorystorage storage; File Size220KB，10 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS128X16A3-10M Overview

SRAM Module, 256KX8, 100ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	APGA, PGA50,5X10
Contacts	50
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	100 ns
Other features	USER CONFIGURABLE AS 128K X 16
I/O type	COMMON
JESD-30 code	R-CPGA-P50
JESD-609 code	e0
length	25.146 mm
memory density	2097152 bi
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	50
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	APGA
Encapsulate equivalent code	PGA50,5X10
Package shape	RECTANGULAR
Package form	GRID ARRAY, PIGGYBACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	7.4676 mm
Maximum standby current	0.0007 A
Minimum standby current	2 V
Maximum slew rate	0.16 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	13.716 mm
Base Number Matches	1

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