DS-72-01 datasheet, PDF - EEWORLD Datasheet

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DS-72-01: DescriptionRechargeable Solid State Energy Storage: 50Î¼Ah, 3.8V; File Size932KB，4 Pages; ManufacturerCYMBET; Websitehttp://www.cymbet.com

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DS-72-01 Overview

Rechargeable Solid State Energy Storage: 50Î¼Ah, 3.8V

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EnerChip

™

CBC050

Rechargeable Solid State Energy Storage: 50µAh, 3.8V

Features

•

All Solid State Construction

SMT Package and Process

Lead-Free Reflow Tolerant

Thousands of Recharge Cycles

Low Self-Discharge

Eco-Friendly, RoHS Compliant

8 mm x 8 mm

QFN SMT Package

5.7 mm x 6.1 mm

Bare Die

Electrical Properties

Output voltage:

Capacity (typical):

Charging source:

Recharge time to 80%:

Charge/Discharge cycles:

3.8V

50µAh

4.00V to 4.15V

20 minutes

>5000 to 10% DOD

Physical Properties

Package size:

Operating temperature:

Storage temperature:

8 mm x 8 mm

-20°C to 70°C

-40°C to 125°C

The EnerChip™ CBC050 is a surface-mount, solid

state, rechargeable energy storage device rated

for 50µAh at 3.8V. It is ideal as a localized, on-

board power source for SRAMs, real-time clocks

and microcontrollers which require standby power

to retain time or data. It is also suitable for RFID

tags, smart sensors, and remote applications

which require a miniature, low-cost, and rugged

power source. For many applications, the CBC050

is a superior alternative to coin cell batteries and

supercapacitors.

Because of their solid state design, EnerChip™

storage devices are able to withstand solder reflow

temperatures and can be processed in high-

volume manufacturing lines similar to conventional

semiconductor devices. There are no harmful gases,

liquids or special handling procedures, in contrast to

traditional rechargeable batteries.

The EnerChip recharge is fast and simple, with a

direct connection to a 4.1V voltage source and

no current limiting components. Recharge time is

20 minutes to 80% capacity. Robust design offers

thousands of charge/discharge cycles. The CBC050

is packaged in an 8 mm x 8 mm quad flat package. It

is available in reels for use with automatic insertion

equipment.

Applications

• Standby supply

for non-volatile SRAM, real-time

clocks, controllers, supply supervisors, and other

system-critical components.

• Wireless sensors and RFID tags

and other

powered, low duty cycle applications.

• Localized power source

to keep microcontrollers

and other devices alert in standby mode.

• Power bridging

to provide backup power to

system during exchange of main batteries.

• Energy Harvesting

by coupling the EnerChip

with energy transducers such as solar panels.

• Embedded Energy

where bare die can be

embedded into modules or co-packaged with

other ICs.

Pin Number(s)

2,3

5-16

Description

V+

V-

NIC

CBC050 Schematic - Top View

Note: NIC = No Internal Connection

DS-72-01 Rev B

Page 1 of 4

EnerChip™ CBC050 Solid State Energy Storage

Printed Circuit Board (PCB) Layout Guidelines and Recommendations

Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup

energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering

power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the

board following soldering. The PCB layout can make this problem worse if the cell’s positive and negative

terminals are routed near each other and under the package, where it is difficult to wash the flux residue away.

To avoid this situation, make sure positive and negative traces are routed outside of the package footprint to

ensure that flux residue will not cause a discharge path between the positive and negative pads. Similarly, a

leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of

the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the

reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a solder pad in the

region where the exposed die pad of the package will land. It is sufficient to place PCB solder pads only where

the package leads will be. That region of the PCB where the exposed die pad will land must not have any solder

pads, traces, or vias.

When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of

the package and all metal pads. Failure to observe this precaution can result in package cracking during solder

reflow due to the silk screen material interfering with the solder solidification process during cooling.

A recommended CBC050 PCB layout is shown in Figure 1 below. Notice that there should not be a center pad

on the PCB to mate with the exposed die pad on the CBC050 package. Again, this is to reduce the possible

number and severity of leakage paths between the EnerChip terminals.

Dimensions in inches [mm]

Figure 1: Recommended PCB layout for the CBC050 package. Do not route signal traces under the EnerChip

as they could become shorted to the die pad (as shown by the dotted lines) on the package underside.

Soldering, Rework, and Electrical Test

Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit

boards, and for instructions on in-circuit electrical testing of the EnerChip.

Disclaimer of Warranties; As Is

The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any

kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the

implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of

dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users

shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted

for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and

any use of the Cymbet EnerChip product described herein in any such product or applications.

DS-72-01 Rev B

Page 4 of 4

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