EEWORLDEEWORLDEEWORLD

Part Number

Search

C0603C122K1RAC7013

Description
Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0012uF, Surface Mount, 0603, CHIP
CategoryPassive components    capacitor   
File Size33KB,1 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance  
Download Datasheet Parametric View All

C0603C122K1RAC7013 Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0012uF, Surface Mount, 0603, CHIP

C0603C122K1RAC7013 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerKEMET
package instruction, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.0012 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.8 mm
JESD-609 codee3
length1.6 mm
Manufacturer's serial numberC0603C122K1RAC7013
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, PAPER, 7 INCH
positive tolerance10%
Rated (DC) voltage (URdc)100 V
seriesC(SIZE)C(X7R)
size code0603
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width0.8 mm
C0603C122K1RAC7013
Capacitor, ceramic, 1200 pF, +/-10% Tol, 100V, X7R, 0603
Dimensions (mm)
ID
L
W
T
B
S
Specifications
Tolerance
+/-0.15
+/-0.15
+/-0.07
+/-0.15
min
Manufacturer:
Capacitance:
Chip Size:
Voltage:
Temperature Coefficient:
Tolerance:
Application:
Termination Type:
Marked:
Dissipation Factor:
Insulation Resistance:
Dielectric Strength:
Package Kind:
Package Size:
Package Type:
Package Quantity:
KEMET
1200 pF
0603
100V
X7R
+/-10%
Std Chip
Tin
Yes
2.5%
100 GOhm
250V
T&R
7in
Paper Tape
4000
Dimension
1.60
0.80
0.8
.35
0.7
© 2006-2012 IntelliData.net
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but
are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or
use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct
products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of
our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
WINCE interface design options
The company is going to transplant the original project to WINCE recently. The previous project was written by me with C++ BUILDER. Now I plan to use VC to develop on WINCE. The specific interface of ...
gncg Embedded System
Looking for experts who are familiar with MCU related technologies and can design products (location Shanghai), part-time job with pay
Our team is developing a product now. We need experts who are familiar with MCU technology to develop circuits and control systems together. The product is not complicated and mainly involves motor co...
killerjch MCU
ADI experts answer popular questions (summary of October 2013)
ADI Chinese Technical Forum: Experts answer hot topics (summary of October 2013) Questions about the input section of the LDF file [url]http://ezchina.analog.com/message/9795#9795[/url] Simulation pro...
dontium ADI Reference Circuit
BT-MSPAUDSINK: Bluetooth and MSP430 Audio Sink Evaluation Module
Looking to buy BT-MSPAUDSINK: Bluetooth and MSP430 Audio Sink evaluation module. If you have any spare, please leave me a message....
568760310 Buy&Sell
About S3C2440, BSP5.0 package, multiple FAT issues
As the title says, I want to realize three drive letters of S3C2440 BINFS + FAT + FAT. The modification has been successful in Eboot, and the three drive letters are also displayed when entering the W...
yyf0986 Embedded System
LED driver power supply PCB design specifications
[b] In any power supply design, the physical design of the PCB board is the last link. Its design method determines the electromagnetic interference and power supply stability. Let's analyze these lin...
qwqwqw2088 LED Zone

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1799  1444  2027  642  1251  37  30  41  13  26 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号