hochtemperaturbeständig, Liefermöglichkeiten auf Anfrage
Standard /
Standard
Mounting Type
/
Befestigungsarten
W
T
Z
Float mounted (see page 15)
/
Schwimmend (siehe Seite15)
Clinch nut 4-40 UNC (see page 59)
/
Einnietmutter 4-40 UNC (siehe Seite 59)
Clinch nut M3 (see page 59)
/
Einnietmutter M3 (siehe Seite 59)
Einnietmutter 4-40 UNC, selbstsichernd (siehe Seite 59)
Einnietmutter M3, selbstsichernd (siehe Seite 59)
TS
Clinch nut 4-40 UNC, self locking (see page 59)
ZS
Clinch nut M3, self locking (see page 59)
No. of Contacts /
Polzahl
Shell size /
Gehäusegröße
09
1
15
2
25
3
37
4
50
5
Contact Type /
Kontaktart
P
Pin contacts /
Stiftkontakte
S
Socket contacts /
Buchsenkontakte
Contact Design (e. g.)
/
Kontaktvariante (z. B.)
0
1
4
5
14
Solder pot
/
Löttopf
Straight PCB termination /
Leiterplattenanschluss, gerade
Wire-wrap /
Wire Wrap
Right angled PCB termination /
Leiterplattenanschluss, abgewinkelt
Straight PCB termination
/
Leiterplattenanschluss, gerade
For more contacts see page 16 onwards
/
Weitere Kontakte siehe Seite 16 ff.
Machined contacts /
Gedrehte Kontakte
S
Stamped contacts
/
Gestanzte Kontakte
Direction of Right Angled Contacts
/
Richtung der abgewinkelten Kontakte
Standard /
Standard
R
Reverse (Not available with stamped contacts)
/
Revers (nicht mit gestanzten Kontakten möglich)
Performance Classes Available in Accordance with DIN 41652
/
Lieferbare Gütestufen nach DIN 41652
Standard insulator /
Standardisolierkörper
G1
= 500 Contact cycles
/
Steckzyklen
= Performance class 1
/
Gütestufe 1
G2
= 200 Contact cycles
/
Steckzyklen
= Performance class 2
/
Gütestufe 2
G3
= 50 Contact cycles
/
Steckzyklen
= Performance class 3
/
Gütestufe 3
Pin connector with dimples
/
Stiftsteckverbinder mit Kontaktnoppen
FM insulator /
FM-Isolierkörper
All connectors are in accordance with the standards of performance class 1; no performance class
number necessary! (1.3 µm (51 microinches) Au over Ni)
Alle Steckverbinder erfüllen die Anforderungen der Gütestufe 1; Typenbezeichnung ohne Gütestufen!
(1,3 µm Au über Ni)
Modifications
/
Modifikationen
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
DS 10/2007
9
Technical Data
Technische Daten
Mechanical Data
Mechanische Daten
Mechanical Data
Mechanische Daten
Mating force per signal contact
Steckkraft pro Signalkontakt
Unmating force per signal contact
Ziehkraft pro Signalkontakt
max. torque *
max. Anzugsmoment *
* Not for locking screws
* Nicht für Verriegelungsschrauben
3,4 N
0,2 N
40 Ncm (0,295 ft.lb.)
40 Ncm
Electrical Data
Elektrische Daten
Electrical Data
Elektrische Daten
Current rating at room temperature
Maximale Stromstärke bei Raumtemperatur
Test voltage between 2 contacts / shell and contact
Prüfspannung zwischen 2 Kontakten bzw. Kontakt und Gehäuse
Meets transition resistance requirements per contact pair in line with DIN 41652:
Erfüllt Übergangswiderstand pro Kontaktpaar nach DIN 41652 für:
- Straight contacts
/
gerade Kontakte
- Right angled contacts
/
abgewinkelte Kontakte
- Right angled contacts - 50 way
/
abgewinkelte Kontakte bei 50 Polen
Insulation resistance between contacts
Isolationswiderstand Kontakt / Kontakt
Volume resistivity
Spezifischer Durchgangswiderstand
Dielectric strength
Spezifische Durchschlagsfestigkeit
5A
1200 V / 1 min.
10 m
25 m
35 m
5000 M
10
16
cm
50 kV / mm
Materials and Platings
Materialien und Oberflächen
Materials and Platings
Materialien und Oberflächen
Shell
Gehäuse
Type /
Type
Insulator
Isolierkörper
Steel
Stahl
FH
Polyester, heat resistant,
glass filled (UL94V-0), natural
Polyester,
hochtemperaturbeständig,
glasfaserverstärkt (UL94V-0), natur
150 °C (302 °F)
F
Polyester, glass filled
(UL94V-0), white
Polyester, glasfaserverstärkt
(UL94V-0), weiß
FM
Polyester, glass filled (UL94V-0),
green
Polyester, glasfaserverstärkt
(UL94V-0), grün
Relative temperature index according
to UL 746 B
rel.
Temperaturindex nach
UL 746 B
Heat deflection temperature limit
according to DIN 53461 HDT/A
Formbeständigkeitstemperatur nach
DIN 53461 HDT/A
Sub temperature limit
Untere Grenztemperatur
Shell plating (standard)
Gehäuseoberfläche (Standard)
Shell (standard)
Gehäuse (Standard)
Shell (K120)
Gehäuse (K120)
125 °C (257 °F)
130 °C (266 °F)
200 °C (392 °F)
255 °C ( 491 °F)
210 °C (410 °F)
-55 °C (-67 °F)
Tin plated over nickel
verzinnt über Nickel
-55 °C (-67 °F)
-55 °C (-67 °F)
Yellow chromate over zinc plating
Not RoHS compliant
verzinkt und gelb chromatiert
nicht RoHS konform
Pin connector shell without dimples
Stiftsteckverbindergehäuse ohne
Kontaktnoppen
Tin plated over nickel, pin connector
shell
with
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
mit
Kontaktnoppen
Tin plated over nickel, pin connector
shell
without
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
ohne
Kontaktnoppen
Pin connector shell with dimples
Stiftsteckverbindergehäuse mit Kontaktnoppen
Shell (K121)
Gehäuse (K121)
Contact material
Kontaktmaterial
Copper alloy
Kupfer-Legierung
10
DS 10/2007
TECHNISCHE ÄNDERUNGEN VORBEHALTEN – MAßE IN MILLIMETER (INCHES IN KLAMMERN)
Technical Data
Technische Daten
Modifications
Modifikationen
All FCT D-Sub connectors (including crimp versions etc.) are available in many different combinations of materials and platings. For example, shells can
be supplied in a non – magnetic version made of brass, which can be electroless nickel, or gold plated for use in aerospace technology.
Alle FCT D-Sub Steckverbinder (auch Crimp Versionen, usw.) sind in vielen verschiedenen Material- und Oberflächenkombinationen erhältlich. So z. B.
Gehäuse in nichtmagnetischer Ausführung aus Messing bzw. chemisch vernickelte oder vergoldete Gehäuse für Luft- und Raumfahrtanwendungen.
Contact Arrangements
Polbilder
Face view of socket connector
Blick auf Steckseite Buchsensteckverbinder
Face view of pin connector
Blick auf Steckseite Stiftsteckverbinder
Shell Size
Gehäusegröße
Number of Contacts
Polzahl
Pin Connector, Connecting Side
Stiftsteckverbinder, Ansicht steckseitig
1
9
2
15
3
25
4
37
5
50
DS 10/2007
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
[p=26, null, left][color=#000][font=Arial]This article is a follow-up to the previous one. [/font][/color][/p][p=26, null, left][color=#000][font=Arial] The core code is as follows (part omitted): [/f...
Like many people, I just made a WINCE system to use. I can successfully unpack it and enter the WINCE system by using DOS+LOADCEPC+BN.BIN. However, I have not been able to successfully enter the syste...
[i=s]This post was last edited by qwqwqw2088 on 2016-10-13 10:14[/i] [p=24, null, left][color=#2e2e2e] Let's take a look at the role of inductance in circuit boards, and what are the advantages of fer...
I have recently been learning how to use FIR filters. I have been reading about it for a few days and it seems interesting, but I don’t quite understand how to use it specifically. Let me talk about i...
A line scan lens is an industrial lens used with line scan cameras. Its imaging principle is to capture the image of the workpiece using a linear sensor and then perform digital signal processing t...[Details]
Current Development Status of DVR Market
A DVR, or digital video recorder, uses a hard disk for recording, unlike traditional analog video recorders. It's often called a DVR because it's a com...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
On August 18th, Galaxis, a specialist in integrated intelligent intralogistics robotics, officially unveiled its next-generation, ultra-narrow aisle forklift mobile robot, the "VFR Ultra-Narrow Ser...[Details]
UPS stands for Uninterruptible Power Supply, which includes energy storage devices. It is mainly used to provide uninterruptible power supply for devices that require high power stability.
...[Details]
A half-bridge is an inverter topology for converting DC to AC. A typical half-bridge circuit consists of two controller switches, a three-wire DC power supply, two feedback diodes, and two capacito...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
introduction
The widespread use of air conditioner communication circuits began with the rise of household inverter air conditioners. With China's energy conservation and emission reduction in...[Details]
0 Introduction
With a rapidly aging population, a young couple is now required to care for an increasing number of elderly people, leading to a growing difficulty in providing care for them. E...[Details]
Renesas Electronics introduces a new USB-C power solution with an innovative three-level topology.
Improve performance while reducing system size
New solution combines excel...[Details]
As the power density of modern electronic systems continues to increase, effective thermal management has become critical to ensuring system performance, reliability, and longevity—especially in hi...[Details]
At present, the most troubling thing about pure electric vehicles as new energy sources is not only the range anxiety, but also the disadvantage of long charging time. At present, ternary lithium b...[Details]
The power transmission system between a car's engine and drive wheels is called its drivetrain. It ensures the necessary traction and speed under various driving conditions, and coordinates these t...[Details]
We know that the power output by the engine does not directly act on the wheels to drive the car, but needs to pass through a series of power transmission mechanisms. So how is the power transmitte...[Details]
In recent years, with the development of MOSFETs, they have gradually replaced transistors in the low-power, fast-switching industry. Major manufacturers in this field have also been reducing their...[Details]
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
