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MB10F

Description
0.8A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
File Size187KB,2 Pages
ManufacturerFORMOSA
Websitehttp://www.formosams.com/
Download Datasheet Compare View All

MB10F Overview

0.8A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER

MB05F – MB10F
0.8A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Formosa MS
MBF
Features
!
!
!
!
!
Glass Passivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Surge Current Capability
Designed for Surface Mount Application
_
+

0.7
+
0.2
Mechanical Data
!
!
!
!
!
!
!
Case: MB-F, Molded Plastic
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: As Marked on Case
Weight: 0.082 grams (approx.)
Mounting Position: Any
Marking: Type Number
Lead Free: For RoHS / Lead Free Version,
SK
FM
ter
in
~
3
1
2.5
68
~
1
30
0
58
0
7.0 MAX.
+
0.2
3.7
+
0.2
1.5
+
0.2
0.65
+
0.15
4.7
+
0.2
0.25
+
0.1
0.2
1.5
+
0.2
0.9
+
0.2
Dimensions in millimeters(1mm =0.0394")
Maximum Ratings and Electrical Characteristics
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
@T
A
=25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note 1) @T
A
= 40°C
Average Rectified Output Current (Note 2) @T
A
= 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I
2
t Rating for Fusing (t < 8.3ms)
Forward Voltage per element
@I
F
= 0.5A
@I
F
= 0.8A
Peak Reverse Current
At Rated DC Blocking Voltage
@T
A
= 25°C
@T
A
= 125°C
Symbo
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
MB05F
MB1F
MB2F
MB4F
MB6F
MB8F
MB10F
Unit
50
35
100
70
200
140
400
280
0.5
0.8
30
5.0
1.0
1.1
600
420
800
560
1000
700
V
V
A
I
FSM
I
2
t
V
FM
A
A
2
s
V
I
RM
C
j
R
JA
R
JL
T
j
, T
STG
5.0
500
13
60
16
-55 to +150
µA
pF
°C/W
°C
Typical Junction Capacitance per leg (Note 3)
Typical Thermal Resistance per leg (Note 1)
Operating and Storage Temperature Range
Note: 1. Mounted on glass epoxy PC board with 1.3mm
2
solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm
2
solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2010/03/10
Revision
C
Page.
2
Page 1
DS-241103

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