Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | FUJITSU |
| Parts packaging code | DIP |
| package instruction | DIP, DIP20,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Maximum access time | 100 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | FAST PAGE DRAM |
| memory width | 4 |
| Number of terminals | 20 |
| word count | 262144 words |
| character code | 256000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum standby current | 0.00025 A |
| Maximum slew rate | 0.055 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MB81C4256-10LC | MB81C4256-70LPJ | MB81C4256-80LC | MB81C4256-10LPSZ | MB81C4256-80LP | MB81C4256-80LPJ | MB81C4256-10LPJ | |
|---|---|---|---|---|---|---|---|
| Description | Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 80ns, CMOS, CDIP20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20, PLASTIC, LCC-26/20 |
| package instruction | DIP, DIP20,.3 | SOJ, SOJ20/26,.34 | DIP, DIP20,.3 | ZIP, ZIP20,.1 | DIP, DIP20,.3 | SOJ, SOJ20/26,.34 | SOJ, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 100 ns | 70 ns | 80 ns | 100 ns | 80 ns | 80 ns | 100 ns |
| JESD-30 code | R-XDIP-T20 | R-PDSO-J20 | R-XDIP-T20 | R-PZIP-T20 | R-PDIP-T20 | R-PDSO-J20 | R-PDSO-J20 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOJ | DIP | ZIP | DIP | SOJ | SOJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| Maker | FUJITSU | - | FUJITSU | FUJITSU | FUJITSU | FUJITSU | - |
| Parts packaging code | DIP | LCC | DIP | ZIP | DIP | LCC | - |
| Contacts | 20 | 26/20 | 20 | 20 | 20 | 26/20 | - |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| Encapsulate equivalent code | DIP20,.3 | SOJ20/26,.34 | DIP20,.3 | ZIP20,.1 | DIP20,.3 | SOJ20/26,.34 | - |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Maximum standby current | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | - |
| Maximum slew rate | 0.055 mA | 0.072 mA | 0.065 mA | 0.055 mA | 0.065 mA | 0.065 mA | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |