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DL756A

Description
Zener Diode, 8.2V V(Z), 5%, 0.5W, Silicon, Unidirectional, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size73KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

DL756A Overview

Zener Diode, 8.2V V(Z), 5%, 0.5W, Silicon, Unidirectional, MINIMELF-2

DL756A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage8.2 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current20 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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DL746
THRU
DL759
Features
Low reverse leakage current
Zener Voltage 3.3V to 12V
Silicon Planar Power Zener Diodes
Standards zener voltage tolerance is ±10% , Add suffix “ A” for
±5% tolerance, other tolerances are available upon request
0.5W Silicon Planar
Zener Diodes
Minimelf
Cathode Mark
Mechanical Data
Case:Minimelf
Package
Polarity: Color band denotes cathode end
Weight: Approx. 0.05gram
Maximum Ratings
Symbol
Zener Current
Power Dissipation
@ T
A
=50
o
C
Junction Temperature
Storage Temperature
Range
P
tot
T
J
T
STG
Value
See Table 1
500
200
-65 to
200
Units
mW
o
C
C
C
A
B
o
Electrical Characteristics @ 25°C Unless Otherwise Specified
Symbol
Thermal resistance
Forward Voltage
@ I
F
=200mA
R
q
JA
DIMENSIONS
INCHES
MIN
.134
.008
.055
MM
MIN
3.40
.20
1.40
Maximum
300
1.5
Unit
o
C/W
V
V
F
DIM
A
B
C
MAX
.142
.016
.059
MAX
3.60
.40
1.50
NOTE
NOTE:
1) Valid provided that a distance of 8mm from case are kept
at ambient temperature
2) Power derating: 4.0mW/
o
C above 50
o
C
SUGGESTED SOLDER
PAD LAYOUT
0.105
0.075”
0.030”
www.mccsemi.com
1 of 3
Revision: 1
2006/08/28
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