万和兴电子有限公司 www.whxpcb.com
AO4494
30V N-Channel MOSFET
General Description
The AO4494 combines advanced trench MOSFET
technology with a low resistance package to provide
extremely low R
DS(ON)
. This device is for PWM
applications.
Product Summary
V
DS
(V) = 30V
I
D
= 18A
R
DS(ON)
< 6.5mΩ
R
DS(ON)
< 9.5mΩ
(V
GS
= 10V)
(V
GS
= 10V)
(V
GS
= 4.5V)
100% UIS Tested
100% R
g
Tested
SOIC-8
Top View
D
D
D
D
Bottom View
D
G
S
S
S
G
S
Absolute Maximum Ratings T
A
=25° unless otherwise noted
C
Parameter
Symbol
V
DS
Drain-Source Voltage
Maximum
30
±20
18
14
130
32
51
3.1
2
-55 to 150
Units
V
V
A
A
mJ
W
°
C
Gate-Source Voltage
Continuous Drain
Current
Pulsed Drain Current
C
Avalanche Current
C
C
V
GS
T
C
=25°
C
T
C
=70°
C
I
D
I
DM
I
AR
E
AR
P
D
T
J
, T
STG
Repetitive avalanche energy L=0.1mH
C
T
C
=25°
Power Dissipation
B
C
T
C
=70°
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
A
Maximum Junction-to-Ambient
A D
Maximum Junction-to-Lead
Symbol
t
≤
10s
Steady-State
Steady-State
R
θJA
R
θJL
Typ
28
59
16
Max
40
75
24
Units
°
C/W
°
C/W
°
C/W
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AO4494
万和兴电子有限公司 www.whxpcb.com
Electrical Characteristics (T
J
=25° unless otherwise noted)
C
Symbol
Parameter
Conditions
I
D
=250µA, V
GS
=0V
V
DS
=30V, V
GS
=0V
T
J
=125°
C
V
DS
=0V, V
GS
= ±20V
V
DS
=V
GS
I
D
=250µA
V
GS
=10V, V
DS
=5V
V
GS
=10V, I
D
=18A
R
DS(ON)
g
FS
V
SD
I
S
Static Drain-Source On-Resistance
V
GS
=4.5V, I
D
=16A
Forward Transconductance
Diode Forward Voltage
V
DS
=5V, I
D
=18A
I
S
=1A,V
GS
=0V
C
T
J
=125°
1.5
130
5.4
8.4
7.5
70
0.75
1
3
1270
V
GS
=0V, V
DS
=15V, f=1MHz
V
GS
=0V, V
DS
=0V, f=1MHz
170
87
0.8
24
V
GS
=10V, V
DS
=15V, I
D
=18A
12
4.2
4.7
V
GS
=10V, V
DS
=15V, R
L
=0.83Ω,
R
GEN
=3Ω
I
F
=18A, dI/dt=500A/µs
2
Min
30
Typ
Max
Units
V
STATIC PARAMETERS
BV
DSS
Drain-Source Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
I
D(ON)
Zero Gate Voltage Drain Current
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
1
5
±100
2
2.5
6.5
10.1
9.5
µA
nA
V
A
mΩ
mΩ
S
V
A
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
Maximum Body-Diode Continuous Current
1590
240
145
1.5
30
15
5.2
7.8
6.7
3.5
22.5
4
22
19
28
24
DYNAMIC PARAMETERS
Input Capacitance
C
iss
C
oss
C
rss
R
g
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
1900
310
200
2.3
36
18
6.2
11
SWITCHING PARAMETERS
Q
g
(10V) Total Gate Charge
Q
g
(4.5V) Total Gate Charge
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge I
F
=18A, dI/dt=500A/µs
34
30
ns
nC
A. The value of R
θJA
is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with T
A
=25° The
C.
Power dissipation P
DSM
is based on R
θJA
and the maximum allowed junction temperature of 150° The value in any given application depends
C.
on the user's specific board design.
B. The power dissipation P
D
is based on T
J(MAX)
=150° using junction-to-case thermal resistance, and is more useful in setting the upper
C,
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150° Ratings are based on low frequency and duty cycles to keep initial
C.
T
J
=25°
C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of T
J(MAX)
=150° The SOA curve provides a single pulse ratin g.
C.
Rev1: Nov. 2010
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AO4494
万和兴电子有限公司 www.whxpcb.com
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
140
120
100
7V
10V
6V
100
5V
4.5V
V
DS
=5V
80
I
D
(A)
60
40
20
0
0
1
2
3
4
5
V
DS
(Volts)
Fig 1: On-Region Characteristics (Note E)
12
10
3.5V
I
D
(A)
40
125°C
80
4V
60
20
V
GS
=3V
0
0
1
25°C
2
3
4
5
6
V
GS
(Volts)
Figure 2: Transfer Characteristics (Note E)
1.8
Normalized On-Resistance
1.6
1.4
1.2
1
0.8
0
15
20
25
30
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage (Note E)
5
10
0
25
50
75
100
125
150
175
R
DS(ON)
(m
Ω
)
V
GS
=4.5V
8
6
4
2
V
GS
=10V
V
GS
=10V
I
D
=18A
17
5
V
GS
=4.5V
2
I
D
=16A
10
0
Temperature (°C)
Figure 4: On-Resistance vs. Junction
18
Temperature (Note E)
1.0E+02
25
I
D
=18A
20
R
DS(ON)
(m
Ω
)
1.0E+01
1.0E+00
I
S
(A)
40
125°C
25°C
15
125°C
1.0E-01
1.0E-02
1.0E-03
10
5
25°C
1.0E-04
1.0E-05
0
2
4
6
8
10
V
GS
(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AO4494
万和兴电子有限公司 www.whxpcb.com
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
V
DS
=15V
I
D
=18A
Capacitance (pF)
2200
2000
8
1800
1600
1400
1200
1000
800
600
400
200
0
0
15
20
25
Q
g
(nC)
Figure 7: Gate-Charge Characteristics
5
10
30
0
0
C
rss
C
iss
V
GS
(Volts)
6
4
C
oss
2
15
20
25
V
DS
(Volts)
Figure 8: Capacitance Characteristics
5
10
30
90.00
I
D
(A), Peak Avalanche Current
T
A
=25°C
80.00
10µs
1000.0
100.0
R
DS(ON)
limited
10µs
70.00
60.00
50.00
40.00
30.00
20.00
0.000001
T
A
=150°C
T
A
=100°C
I
D
(Amps)
10.0
1.0
0.1
0.0
0.1
1
10
100µs
1ms
10ms
100ms
10s
DC
100
T
A
=125°C
T
J(Max)
=150°
C
T
A
=25°
C
0.00001
0.0001
0.001
Time in avalanche, t
A
(s)
Figure 12: Single Pulse Avalanche capability
(Note C)
V
DS
(Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
1000
T
A
=25°C
100
Power (W)
10
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 15: Single Pulse Power Rating Junction-to-Ambient (Note F)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AO4494
万和兴电子有限公司 www.whxpcb.com
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
Z
θ
JA
Normalized Transient
Thermal Resistance
D=T
on
/T
T
J,PK
=T
A
+P
DM
.Z
θJA
.R
θJA
R
θJA
=40°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
40
0.1
P
D
0.01
Single Pulse
T
on
T
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note F)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
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