EEWORLDEEWORLDEEWORLD

Part Number

Search

BUX54SMD-JQR

Description
Power Bipolar Transistor, 2A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AB, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size10KB,1 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

BUX54SMD-JQR Overview

Power Bipolar Transistor, 2A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-276AB, Ceramic, Metal-Sealed Cofired, 3 Pin, HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN

BUX54SMD-JQR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTT Electronics plc
package instructionHERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
Reach Compliance Codecompliant
Shell connectionCOLLECTOR
Maximum collector current (IC)2 A
Collector-emitter maximum voltage400 V
ConfigurationSINGLE
Minimum DC current gain (hFE)20
JEDEC-95 codeTO-276AB
JESD-30 codeR-CBCC-N3
Number of components1
Number of terminals3
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON
Nominal transition frequency (fT)8 MHz
BUX54SMD
Dimensions in mm (inches).
0.89
(0.035)
min.
3.70 (0.146)
3.41 (0.134)
3.70 (0.146)
3.41 (0.134)
3.60 (0.142)
Max.
4.14 (0.163)
3.84 (0.151)
Bipolar NPN Device in a
Hermetically sealed
Ceramic Surface Mount
Package for High
Reliability Applications
1
3
0.76
(0.030)
min.
16.02 (0.631)
15.73 (0.619)
Bipolar NPN Device.
V
CEO
= 400V
I
C
= 2A
10.69 (0.421)
10.39 (0.409)
2
9.67 (0.381)
9.38 (0.369)
11.58 (0.456)
11.28 (0.444)
0.50 (0.020)
0.26 (0.010)
All Semelab hermetically sealed products
can be processed in accordance with the
requirements of BS, CECC and JAN,
JANTX, JANTXV and JANS specifications
SMD1 (TO276AB)
PINOUTS
1 – Base
2 – Collector
3 – Emitter
Parameter
V
CEO
*
I
C(CONT)
h
FE
f
t
P
D
Test Conditions
Min.
Typ.
Max.
400
2
Units
V
A
-
Hz
@ 4/0.6 (V
CE
/ I
C
)
20
8M
60
10
W
* Maximum Working Voltage
This is a shortform datasheet. For a full datasheet please contact
sales@semelab.co.uk.
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
Generated
15-Aug-02
Please help, EVC cannot connect to 2410 development board
Activesync can connect successfully, but the test in PM configuration cannot pass. I select MS Activesync for both Transport and Startup. During the test, it keeps saying Establishing platform manager...
qqwweerr Embedded System
How to calibrate the clock of MSP430F2131
MSP430F2131, check the chip manual, this chip does not have XT2 clock source, and the high-frequency clock can only use DCOCLK. If a 12M clock source is needed, but the factory DCOCLK accuracy does no...
火辣西米秀 Microcontroller MCU
[My Favorite MSP432] + First Look at MSP432
Recently, I took some time to study the course "In October, we will learn MSP432 from Teacher Jin Erya". I was deeply attracted by the performance of MSP432. MSP432 continues to inherit the low-power ...
sxwsyc Microcontroller MCU
【Book Collection】High-Speed PCB Design Guide
With the massive increase in system design complexity and integration, electronic system designers are engaged in circuit design above 100MHZ, and the operating frequency of the bus has reached or exc...
wzt PCB Design
PCB board design: What is the use of mark points and how to set them?
[i=s]This post was last edited by qwqwqw2088 on 2018-3-21 11:41[/i] [size=4]After the PCB board is made, components need to be mounted. Now the mounting of components is done by machines (SMT). Mark p...
qwqwqw2088 PCB Design
Where are proximity switches used most?
Where are proximity switches used most? Are there any in automation equipment factories?...
戴红广 Sensor

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2451  824  540  631  2639  50  17  11  13  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号