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INTEL-82801IH(ICH9DH)

Description
Micro Peripheral IC, CMOS, PBGA676
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size5MB,814 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

INTEL-82801IH(ICH9DH) Overview

Micro Peripheral IC, CMOS, PBGA676

INTEL-82801IH(ICH9DH) Parametric

Parameter NameAttribute value
MakerIntel
package instructionBGA, BGA676,30X30,40
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B676
Number of terminals676
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA676,30X30,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1.1,1.5,3.3,5 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Intel
®
I/O Controller Hub 9 (ICH9)
Family
Datasheet
– For the Intel
®
82801IB ICH9, 82801IR ICH9R, and 82801IH ICH9DH,
82801IO ICH9DO I/O Controller Hubs
August 2007
Document Number: 316972-002

INTEL-82801IH(ICH9DH) Related Products

INTEL-82801IH(ICH9DH) INTEL-82801IB(ICH9) INTEL-82801IR(ICH9R)
Description Micro Peripheral IC, CMOS, PBGA676 Micro Peripheral IC, CMOS, PBGA676 Micro Peripheral IC, CMOS, PBGA676
Maker Intel Intel Intel
package instruction BGA, BGA676,30X30,40 BGA, BGA676,30X30,40 BGA, BGA676,30X30,40
Reach Compliance Code compliant compliant compliant
JESD-30 code S-PBGA-B676 S-PBGA-B676 S-PBGA-B676
Number of terminals 676 676 676
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA676,30X30,40 BGA676,30X30,40 BGA676,30X30,40
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.1,1.5,3.3,5 V 1.1,1.5,3.3,5 V 1.1,1.5,3.3,5 V
Certification status Not Qualified Not Qualified Not Qualified
surface mount YES YES YES
technology CMOS CMOS CMOS
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
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