IO138NDB3V3 datasheet, PDF - EEWORLD Datasheet

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IO138NDB3V3: DescriptionFPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208; Categorysemiconductor Programmable logic devices; File Size10MB，212 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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IO138NDB3V3 Overview

FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208

IO138NDB3V3 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	208
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	1.58 V
Minimum supply/operating voltage	1.42 V
Rated supply voltage	1.5 V
Processing package description	28 × 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, Plastic, Quad Flat Package-208
state	TRANSFERRED
Craftsmanship	CMOS
packaging shape	SQUARE
Package Size	FLATPACK, FINE PITCH
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
terminal coating	tin lead
Terminal location	Four
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
organize	24576 CLBS, 1,000,000 doors
Maximum FCLK clock frequency	350 MHz
Number of configurable logic modules	24576
Programmable logic type	FIELD PROGRAMMABLE GATE array
Number of equivalent gate circuits	1.00E6

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Revision 3

Military ProASIC3/EL Low Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Military Temperature Tested and Qualified

• Each Device Tested from –55°C to 125°C

Advanced and Pro (Professional) I/Os

††

•

700 Mbps DDR, LVDS-Capable I/Os

1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

†

Bank-Selectable I/O Voltages—up to 8 Banks per Chip

Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and

LVCMOS 2.5 V / 5.0 V Input

†

Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS

Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II (A3PE3000L only)

I/O Registers on Input, Output, and Enable Paths

Hot-Swappable and Cold-Sparing I/Os

Programmable Output Slew Rate and Drive Strength

Programmable Input Delay (A3PE3000L only)

Schmitt Trigger Option on Single-Ended Inputs (A3PE3000L)

Weak Pull-Up/-Down

IEEE 1149.1 (JTAG) Boundary Scan Test

Pin-Compatible Packages across the Military ProASIC

3EL Family

• Architecture Supports Ultra-High Utilization

Firm-Error Immune

• Not Susceptible to Neutron-Induced Configuration Loss

Low Power

• Dramatic Reduction in Dynamic and Static Power

• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power

†

• Low Power Consumption in Flash*Freeze Mode Allows for

Instantaneous Entry To / Exit From Low-Power Flash*Freeze

Mode

• Supports Single-Voltage System Operation

• Low-Impedance Switches

High Capacity

• 250K to 3M System Gates

• Up to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

•

130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

Live-at-Power-Up (LAPU) Level 0 Support

Single-Chip Solution

Retains Programmed Design when Powered Off

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks—One Block with Integrated PLL in ProASIC3

and All Blocks with Integrated PLL in ProASIC3EL

• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,

and External Feedback

• Wide Input Frequency Range 1.5 MHz to 250 MHz (1.2 V

systems) and 350 MHz (1.5 V systems)

High Performance

• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System

Performance

• 3.3 V, 66 MHz, 64-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit

PCI (1.2 V systems)

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous

Operation:

– 250 MHz: For 1.2 V Systems

– 350 MHz: For 1.5 V Systems

• ARM Cortex™-M1 Soft Processor Available with or without

Debug

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

to Secure FPGA Contents

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

Table 1 •

Military ProASIC3/EL Low-Power Devices

A3P250

ARM

Processor Support in ProASIC3/EL FPGAs

ProASIC3/EL Devices

Devices

A3PE600L

A3P1000

M1A3P1000

24,576

144

Yes

154

PQ208

FG144, FG484

A3PE3000L

M1A3PE3000L

75,264

504

112

Yes

620

ARM Cortex-M1

System Gates

250,000

600,000

VersaTiles (D-flip-flops)

6,144

13,824

RAM kbits (1,024 bits)

108

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP

Yes

Integrated PLL in CCCs

VersaNet Globals

I/O Banks

Maximum User I/Os

270

Package Pins

VQFP

VQ100

PQFP

FBGA

FG484

Notes:

1. Refer to the

Cortex-M1

product brief for more information.

2. AES is not available for ARM-enabled ProASIC3/EL devices.

† A3P250 and A3P1000 support only 1.5 V core operation.

ƒ Flash*Freeze technology is not available for A3P250 or A3P1000.

††Pro I/Os are not available on A3P250 or A3P1000.

September 2012

FG484, FG896

Military ProASIC3/EL Low Power Flash FPGAs

Table of Contents

Military ProASIC3/EL Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Military ProASIC3/EL DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-112

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-121

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-125

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-127

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-148

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-149

Pin Descriptions and Packaging

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User-Defined Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1

3-2

3-4

3-5

Package Pin Assignments

VQ100

PQ208

FG144

FG484

FG896

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-25

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

Revision 3

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