RF C
ERAMIC
C
HIP
I
NDUCTORS
High frequency multi-layer chip inductors feature a monolithic body
made of low loss ceramic and high conductivity metal electrodes to
achieve optimal high frequency performance.
These RF chip inductors are compact in size and feature lead-free tin
plated nickel barrier terminations and tape and reel packaging which
makes them ideal for small size/high volume wireless applications.
A
PPLICATIONS
• CELL/PCS Modules
• Broadband Components
• RF Tranceivers
• Wireless LAN
• RFID
• Custom Applications
P
RODUCT
R
ANGE
S
UMMARY
EIA SIZE (mm)
0201 (0603)
0402 (1005)
0603 (1608)
0805 (2012)
SIZE CODE
L-05
L-07
L-14
L-15
L RANGE
1.0 - 39 nH
1.0 - 120 nH
1.0 - 220 nH
1.5 - 680 nH
Q FACTOR (Min.)
4
8
12
8
(100 MHz)
(100 MHz)
(100 MHz)
(100 MHz)
SRF (Typ.)
>21 GHz (1.0 nH)
>21 GHz (1.0 nH)
>23 GHz (1.0 nH)
>21 GHz (1.5 nH)
TEMPERATURE
-40°C to + 100°C
-40°C to + 100°C
-40°C to + 100°C
-40°C to + 100°C
M
ECHANICAL
C
HARACTERISTICS
E/B
T
0201 (0603)
Inches
mm
0402 (1005)
Inches
mm
0603 (1608)
Inches
mm
0805 (2012)
Inches
mm
W
L
Length
.024 ±.001”
Width
.012 ±.001”
Thickness
.012 ±.001”
End Band
.006 ±.002”
(0.6 ±0.03) .039 ±.004” (1.00 ±.10) .063 ±.006” (1.60 ±.15) .079 ±.008” (2.00 ±.20)
(0.3 ±0.03) .020 ±.004” (0.50 ±.10) .031 ±.006” (0.80 ±.15) .047 ±.008” (1.20 ±.20)
(0.3 ±0.03) .020 ±.004” (0.50 ±.10) .031 ±.006” (0.80 ±.15) .033 ±.008” (0.85 ±.20)
(0.15 ±0.05) .009 ±.004” (0.23 ±.10) .012 ±.008” (0.30 ±.20) .020 ±.012” (0.50 ±.30)
H
OW TO
O
RDER
L-
DEVICE
Inductor
07
SIZE
05 = 0201
07 = 0402
14 = 0603
15 = 0805
C
TYPE
Ceramic
10N
VALUE
See Table
S = ± 0.3 nH
J= ± 5%
K = ± 10%
J
TOLERANCE
1.0 to 5.6 nH
6.8 nH and above
3.3 nH and above
V
TERMINATION
V =
Ni/Sn
6
MARKING
4 = No Marking
6 = Orientation Mark
T
TAPE & REEL
Size Code
Tape
Reel
0201 T
Paper
7”
0402 T
Paper
7”
0603 E Embossed 7”
0805 E Embossed 7”
Qty
15,000
10,000
4,000
4,000
Part number written: L-07C10NJV6T
16
www.johansontechnology.com
RF C
HARACTERISTICS
C
HARACTERISTICS
(T
YPICAL
)
INDUCTANCE VS FREQUENCY: SIZE 0402
500
Q VS FREQUENCY: SIZE 0402
100
1N5
80
Inductance (nH)
100
47N
27N
15N
10
60
3N3
6N8
15N
Q
40
6N8
3N3
1N5
1.0
0.01
0.1
1.0
10
20
47N
0
0.01
0.1
1.0
27N
10
Frequency (GHz)
Frequency (GHz)
INDUCTANCE VS FREQUENCY: SIZE 0603
1000
Q VS FREQUENCY: SIZE 0603
100
2N2
80
Inductance (nH)
100
R10
56N
60
4N7
12N
Q
40
27N
56N
20
R10
0
0.01
27N
12N
10
4N7
2N2
1.0
0.01
0.1
1.0
10
0.1
1.0
10
Frequency (GHz)
Frequency (GHz)
INDUCTANCE VS FREQUENCY: SIZE 0805
1000
Q VS FREQUENCY: SIZE 0805
150
2N2
Inductance (nH)
100
R15
R10
56N
100
4N7
12N
27N
56N
R10
R15
0.1
1.0
10
12N
10
4N7
2N2
1.0
Q
50
0
0.01
27N
0.01
0.1
1.0
10
Frequency (GHz)
Frequency (GHz)
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO SOLDERING:
THERMAL SHOCK:
LIFE TEST:
HUMIDITY RESISTANCE:
TERMINAL ADHESION:
PCB DEFLECTION:
Solder coverage 75% of electrodes L=±10% Q=± 20%
No apparent damage Solder coverage 75% L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
No apparent damage L=±10% Q=± 20%
Inductance change: 2% or .5pF Max
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
TEST PARAMETERS
Preheat 120±20°C for 1 min. Dip 230±10°C for 3±1 sec.
Preheat 120±20°C for 1 min. Dip 260±10°C for 10±1 sec.
100 cycles: 30±3 minutes @ +100°C then 30±3 min. @ -40°C
1000 ±48 Hours @ +85±2°C, rated current (1-2 hour recovery)
1000 ±48 Hours @ +40±2°C, 90-95% relative humidity,
rated current (1-2 hour recovery)
Lateral pull force: 0201 1.0Lbs 0402 1.6Lbs
For 0603 2.2Lbs For 0805 4.4Lbs
Glass Epoxy PCB: 1 mm deflection
www.johansontechnology.com
19
Microchip MCU
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