|
Z8530H-4/BQA |
Z8530H-6PC |
Z8530H-6JC |
Z8530H-6DCB |
Z8530H-6DC |
| Description |
Serial I/O Controller, 2 Channel(s), 0.25MBps, MOS, CDIP40, CERAMIC, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, MOS, PDIP40, PLASTIC, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, MOS, PQCC44, PLASTIC, LCC-44 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, MOS, CDIP40, CERAMIC, DIP-40 |
Serial I/O Controller, 2 Channel(s), 0.25MBps, MOS, CDIP40, CERAMIC, DIP-40 |
| Parts packaging code |
DIP |
DIP |
LCC |
DIP |
DIP |
| package instruction |
DIP, |
DIP, |
QCCJ, |
DIP, |
DIP, |
| Contacts |
40 |
40 |
44 |
40 |
40 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
| boundary scan |
NO |
NO |
NO |
NO |
NO |
| Bus compatibility |
8080; Z80; 6800; 68000; MULTIBUS |
8080; Z80; 6800; 68000; MULTIBUS |
8080; Z80; 6800; 68000; MULTIBUS |
8080; Z80; 6800; 68000; MULTIBUS |
8080; Z80; 6800; 68000; MULTIBUS |
| maximum clock frequency |
4 MHz |
6.06 MHz |
6.06 MHz |
6.06 MHz |
6.06 MHz |
| letter of agreement |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC |
| Data encoding/decoding methods |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
| Maximum data transfer rate |
0.25 MBps |
0.25 MBps |
0.25 MBps |
0.25 MBps |
0.25 MBps |
| External data bus width |
8 |
8 |
8 |
8 |
8 |
| JESD-30 code |
R-GDIP-T40 |
R-PDIP-T40 |
S-PQCC-J44 |
R-GDIP-T40 |
R-GDIP-T40 |
| length |
52.2605 mm |
52.324 mm |
16.5862 mm |
52.2605 mm |
52.2605 mm |
| low power mode |
NO |
NO |
NO |
NO |
NO |
| Number of serial I/Os |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
40 |
40 |
44 |
40 |
40 |
| Maximum operating temperature |
125 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| Package body material |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
| encapsulated code |
DIP |
DIP |
QCCJ |
DIP |
DIP |
| Package shape |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
IN-LINE |
CHIP CARRIER |
IN-LINE |
IN-LINE |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.588 mm |
5.715 mm |
4.445 mm |
5.588 mm |
5.588 mm |
| Maximum slew rate |
250 mA |
250 mA |
250 mA |
250 mA |
250 mA |
| Maximum supply voltage |
5.5 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
| Minimum supply voltage |
4.5 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
YES |
NO |
NO |
| technology |
MOS |
MOS |
MOS |
MOS |
MOS |
| Temperature level |
MILITARY |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
QUAD |
DUAL |
DUAL |
| width |
15.24 mm |
15.24 mm |
16.5862 mm |
15.24 mm |
15.24 mm |
| uPs/uCs/peripheral integrated circuit type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Maker |
AMD |
- |
- |
AMD |
AMD |