The emergence of faster data rates, and decreasing signal rise times, requires better
performing, high speed connectors. TE Connectivity’s broad portfolio of high speed
backplane connectors provides system designers the flexibility they require to solve their
specific performance challenges.
INDuSTRy APPLICATIONS
•
Servers- blade, rack mount and
mainframe stackable, carrier grade, core,
edge and Metro Ethernet
•
Switches- Stackable, carrier grade, core,
edge and Metro Ethernet
•
Routers- edge, core, enterprise class,
carrier Ethernet, BRAS and
Multi Service Edge
•
Optical- Transport: carrier grade optical,
metro WDM, optical multi-service
provisioning, long haul optical and
enterprise LAN optical Ethernet
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
Signal Integrity at TE
TE Connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product.
Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presence places simulation,
modeling, and system layout experts next to the customer.
Modeling and Simulation
At TE the design process starts with signal integrity. Signal integrity engineers use sophisticated 3D tools to provide accurate connector and footprint
via pattern performance prior to production. TE has the tools and expertise to get the right answer.
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Ansys HFSS and CST
Microwave Studio Full-wave
3D tools
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Both connector and footprint
via pattern(s) analyzed
before production
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S-parameter and SPICE
analysis
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Sophisticated ADS and
MATLAB system analysis
Test Capability
With measurement capabilities beyond 12.5 Gbps and 50 GHz, TE can characterize and provide detailed measurements for its products. Cutting-edge
measurement calibration techniques and board design enable accurate de-embedding of test fixtures. TE has also teamed with numerous silicon com-
panies to provide active device measurements that can be invaluable to assure the successful implementation of a design.
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Advanced calibration techniques de-embed fixture
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Frequency domain to 50 GHz
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Time domain eye pattern/BERT to 12.5 Gbps
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Active silicon testing – multiple vendors 2 – 10+ Gbps
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Both system and “connector only” boards
Customer Support and Tools
From test boards to simulation models, TE provides a library of tools that help you successfully implement your system.
Requests can be easily made through our signal integrity website: www.te.com/documentation/electrical-models
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Ansys HFSS and CST Microwave Studio Full-wave 3D tools
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Both connector and footprint via pattern(s) analyzed before
production
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S-parameter and SPICE analysis
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Sophisticated ADS and MATLAB system analysis
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Measurement based S-parameter connector models (64+ ports)
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Modeling based S-parameter connector models (64+ ports)
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Footprint via pattern S-parameter and SPICE models
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SPICE connector models
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Connector evaluation test boards
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System test boards
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
STRADA Whisper Connectors
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Up to 40Gb/s performance
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Density up to 20 differential pairs per cm (52 DP per in)
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Available in 4, 6, and 8 pairs/column, supporting cardpitch
of 16.4 mm (.64"), 20.4 mm (.8"), and 25.4 mm (1")
respectively
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See back panel for representative part numbers
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Website: www.te.com/products/stradawhisper
DATA RATE
3-6 GB/s
STRADA Whisper
Connector
52 DP/in
20 DP/cm
6-10 GB/s
10-15 GB/s
15-20 GB/s
20-25 GB/s
25+ GB/s
IMPACT
Connector
80 DP/in
32 DP/cm
Z-PACK TinMan100 Ohm and 85 Ohm
Connector
80 DP/in
32 DP/cm
Z-PACK Slim UHD
Common Speed
Connector
36 DP/in
14 DP/cm
Z-PACK Slim UHD
High Speed
Connector
36 DP/in
14 DP/cm
Z-PACK HM-Zd
Connector
40 DP/in
16 DP/cm
Z-PACK HM-Zd Plus
Connector
40 DP/in
16 DP/cm
MULTIGIG RT
Connector
57 DP/in
23 DP/cm
Z-PACK HS3
Connector
50 DP/in
24 DP/cm
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
Z-PACK HM-Zd and Hm-Zd Plus Connectors
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Up to 12.5 Gb/s performance
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Density up to 16 differential pairs per cm (40 DP per inch), in 25.4 mm (1")
slot-pitch
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Available in 2, 3 and 4 pairs/column, fitting 20.32 mm (0.8") slot-pitch for
2 and 3 pair version and 25.4 mm (1") slot-pitch for the 4 pair version
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HM-Zd Plus provides enhanced signal integrity in a design backwards
compatible with standard HM-Zd
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Advanced Differential Fabric (ADF) Connector specified in the PICMG 3.X
Advanced TCA specifications
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See back panel for representative part numbers
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Order catalog 1773095, "High Speed Backplane Connector"
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Website: http://hmzd.te.com
Z-PACK HS3 Connectors
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Up to 6.25 Gb/s performance
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Density up to 40 high speed signal lines (20 DP) per cm board space, in
25.4 mm (1") slot-pitch
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Available in 2 versions: six row and ten row, respectively fitting 20.32 mm
(0.8") and 25.40 mm (1") slot-pitches
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High-speed connector designed for both single ended and differential
signals
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See back panel for representative part numbers
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Order catalog 1773095, "High Speed Backplane Connector"
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Website: http://hs3.te.com
MuLTIGIG RT Connectors
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Up to 6.25 Gb/s performance
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Density available in 2 versions per tier: 0.8" and 1", respectively fitting
20.32 mm (0.8") and 25.4 mm (1") slot-pitches
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Backplane connector system specified in VME standards: VXS (VITA 41) &
VPX (VITA 46)
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Pinless backplane connector utilizes a PCB construction which allows the
connector system to have extreme flexibility. 100 Ohm differential, 50 Ohm
single ended, open pin field, and power wafers can be mixed within one
connector module.
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See back panel for representative part numbers
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Order catalog 1773095, "High Speed Backplane Connector"
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Website: http://www.multigigrt.com
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
IMPACT Connectors
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Up to 25 Gb/s performance
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Density up to 32 high speed differential pairs per cm (80 DP per inch)
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