BX80547RE2933C/SL7TP datasheet, PDF

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BX80547RE2933C/SL7TP: DescriptionRISC Microprocessor, 32-Bit, 2930MHz, CMOS, PBGA775; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，94 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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BX80547RE2933C/SL7TP Overview

RISC Microprocessor, 32-Bit, 2930MHz, CMOS, PBGA775

BX80547RE2933C/SL7TP Parametric

Parameter Name	Attribute value
Maker	Intel
package instruction	LGA, LGA775,30X33,40
Reach Compliance Code	compliant
bit size	32
JESD-30 code	R-PBGA-N775
Number of terminals	775
Package body material	PLASTIC/EPOXY
encapsulated code	LGA
Encapsulate equivalent code	LGA775,30X33,40
Package shape	RECTANGULAR
Package form	GRID ARRAY
power supply	1.3 V
Certification status	Not Qualified
speed	2930 MHz
Maximum slew rate	78000 mA
Nominal supply voltage	1.3 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal pitch	1 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Intel

Celeron

D Processor 300

Sequence

Datasheet

– On 90 nm Process in the 775-Land Package

December 2005

Document Number: 304092-006

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Celeron

D processor 300 sequence on 90 nm process and in the 775-land package may contain design defects or errors known as errata

which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and

increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number

progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Intel

Extended Memory 64 Technology (Intel

EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.

Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including

details on which processors support EM64T or consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.

Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Celeron, Pentium, Itanium, Intel Xeon, Intel NetBurst and the Intel logo are trademarks or registered trademarks of Intel Corporation or its

subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction....................................................................................................................... 11

1.1

1.2

2.1

2.2

2.3

Terminology......................................................................................................... 12

1.1.1 Processor Packaging Terminology......................................................... 12

References .......................................................................................................... 13

FSB and GTLREF ............................................................................................... 15

Power and Ground Lands ................................................................................... 15

Decoupling Guidelines ........................................................................................ 15

2.3.1 VCC Decoupling..................................................................................... 16

2.3.2 FSB GTL+ Decoupling ........................................................................... 16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking.................................... 16

Voltage Identification ........................................................................................... 17

2.4.1 Phase Lock Loop (PLL) Power and Filter............................................... 19

Reserved, Unused, and TESTHI Signals ............................................................ 20

FSB Signal Groups..............................................................................................20

GTL+ Asynchronous Signals............................................................................... 22

Test Access Port (TAP) Connection.................................................................... 23

FSB Frequency Select Signals (BSEL[2:0]) ........................................................ 23

Absolute Maximum and Minimum Ratings .......................................................... 23

Processor DC Specifications............................................................................... 24

2.11.1 Processor DC Specifications.................................................................. 24

VCC Overshoot Specification.............................................................................. 30

2.12.1 Die Voltage Validation ............................................................................ 30

GTL+ FSB Specifications .................................................................................... 31

Package Mechanical Drawing ............................................................................. 33

Processor Component Keep-Out Zones ............................................................. 37

Package Loading Specifications ......................................................................... 37

Package Handling Guidelines ............................................................................. 37

Package Insertion Specifications ........................................................................ 38

Processor Mass Specification ............................................................................. 38

Processor Materials............................................................................................. 38

Processor Markings............................................................................................. 38

Processor Land Coordinates............................................................................... 40

Processor Land Assignments.............................................................................. 41

Alphabetical Signals Reference .......................................................................... 62

Processor Thermal Specifications....................................................................... 71

5.1.1 Thermal Specifications ........................................................................... 71

5.1.2 Thermal Metrology ................................................................................. 74

Processor Thermal Features............................................................................... 74

5.2.1 Thermal Monitor ..................................................................................... 74

Electrical Specifications.................................................................................................... 15

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

5.1

Package Mechanical Specifications ................................................................................. 33

Land Listing and Signal Descriptions ............................................................................... 41

Thermal Specifications and Design Considerations......................................................... 71

5.2

Datasheet

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

6.1

6.2

Thermal Monitor 2 .................................................................................. 75

On-Demand Mode.................................................................................. 76

PROCHOT# Signal ................................................................................ 77

THERMTRIP# Signal ............................................................................. 77

CONTROL

and Fan Speed Reduction .................................................... 77

Thermal Diode........................................................................................ 78

Features ........................................................................................................................... 79

Power-On Configuration Options ........................................................................ 79

Clock Control and Low Power States.................................................................. 79

6.2.1 Normal State .......................................................................................... 80

6.2.2 HALT Powerdown State ......................................................................... 80

6.2.3 Stop-Grant States .................................................................................. 81

6.2.4 HALT Snoop State, Grant Snoop State ................................................. 81

Mechanical Specifications ................................................................................... 84

7.1.1 Boxed Processor Cooling Solution Dimensions ..................................... 84

7.1.2 Boxed Processor Fan Heatsink Weight.................................................. 86

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach

Clip Assembly ........................................................................................ 86

Electrical Requirements ...................................................................................... 86

7.2.1 Fan Heatsink Power Supply ................................................................... 86

Thermal Specifications........................................................................................ 88

7.3.1 Boxed Processor Cooling Requirements ............................................... 88

7.3.2 Variable Speed Fan ............................................................................... 90

Logic Analyzer Interface (LAI) ............................................................................. 93

8.1.1 Mechanical Considerations .................................................................... 93

8.1.2 Electrical Considerations........................................................................ 93

Boxed Processor Specifications....................................................................................... 83

7.1

7.2

7.3

Debug Tools Specifications.............................................................................................. 93

8.1

Datasheet

Figures

2-1

2-2

2-3

3-1

3-2

3-3

3-4

3-5

3-6

3-7

4-1

4-2

5-1

5-2

5-3

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

7-9

Phase Lock Loop (PLL) Filter Requirements ...................................................... 19

VCC Static and Transient Tolerance for 775_VR_CONFIG_04A .......................27

VCC Overshoot Example Waveform................................................................... 30

Processor Package Assembly Sketch.................................................................33

Processor Package Drawing 1 ............................................................................ 34

Processor Package Drawing 2 ............................................................................ 35

Processor Package Drawing 3 ............................................................................ 36

Processor Top-Side Marking Example (with Processor Number) .......................38

Processor Top-Side Marking Example................................................................ 39

Processor Land Coordinates (Top View) ............................................................ 40

Landout Diagram (Top View – Left Side) ............................................................ 42

Landout Diagram (Top View – Right Side).......................................................... 43

Thermal Profile for Platform Compatibility Guide ‘04 A Processors .................... 73

Case Temperature (TC) Measurement Location................................................. 74

Thermal Monitor 2 Frequency and Voltage Ordering .......................................... 76

Processor Low Power State Machine .................................................................80

Mechanical Representation of the Boxed Processor .......................................... 83

Space Requirements for the Boxed Processor (Side View)................................ 84

Space Requirements for the Boxed Processor (Top View)................................. 85

Space Requirements for the Boxed Processor (Overall View)............................ 85

Boxed Processor Fan Heatsink Power Cable Connector Description................. 87

Baseboard Power Header Placement Relative to Processor Socket.................. 88

Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Top View) .. 89

Boxed Processor Fan Heatsink Airspace Keep-out Requirements (Side View) . 89

Boxed Processor Fan Heatsink Set Points ......................................................... 90

Datasheet

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