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TDF8544SD/N2,112

Description
TDF8544 - I²C-bus controlled 4 x 50 W power amplifier ZIP 27-Pin
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size501KB,54 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

TDF8544SD/N2,112 Overview

TDF8544 - I²C-bus controlled 4 x 50 W power amplifier ZIP 27-Pin

TDF8544SD/N2,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
MakerNXP
Parts packaging codeZIP
Contacts27
Manufacturer packaging codeSOT878-1
Reach Compliance Codeunknown
TDF8544
I
2
C-bus controlled 4
50 W power amplifier
Rev. 2 — 29 August 2011
Product data sheet
1. General description
The TDF8544 is one of a new generation of complementary quad Bridge-Tied Load (BTL)
audio power amplifiers intended for automotive applications. It has full I
2
C-bus controlled
diagnostics, including start-up diagnostics. The TDF8544 can operate at a battery voltage
as low as 6 V making this amplifier suitable for stop/start-car operation.
The amplifier uses a complementary DMOS output stage in a Silicon-On-Insulator (SOI)-
based BCD process. The DMOS output stage ensures a high power output signal with
perfect sound quality. The SOI-based BCD process ensures a robust amplifier, where
latch-up cannot occur, with good separation between the four independent channels, with
every component isolated and without substrate currents.
2. Features and benefits
Stop/start-car prepared: keeps operating without audible disturbance during engine
start at a battery voltage as low as 6 V
Operates in either legacy (non I
2
C-bus) or I
2
C-bus modes (3.3 V and 5 V compliant)
Four hardware-programmable I
2
C-bus addresses
Can drive 2
and 4
loads
Speaker fault detection
Start-up diagnostics with load detection: open, short, present; filtered for door-slam
and chatter relays
AC load (tweeter) detection with low and high current mode
Gain select after start-up without audible disturbance
Independent selectable soft mute of front and rear channels
Programmable gain (26 dB and 16 dB), independently programmable for the front and
rear channels
Line driver mode supports engine start at a battery voltage as low as 6 V (16 dB and
mid-tap voltage 0.25V
P
)
Programmable clip detect: 2 %, 5 % or 10 %
Programmable thermal pre-warning
Pin STB can be programmed/multiplexed with second-clip detect
Clip information of each channel can be directed separately to pin DIAG or pin STB
Independent enabling of thermal-, clip- or load fault information (short across the load
or to V
P
or to ground) on pin DIAG
Loss-of-ground and open V
P
safe (minimum series resistance required)
All amplifier outputs short-circuit proof to ground, supply voltage and across the load
(channel independent)
All pins short-circuit proof to ground

TDF8544SD/N2,112 Related Products

TDF8544SD/N2,112 TDF8544J/N2 TDF8544J/N2,112 TDF8544SD/N2 TDF8544TH/N2,518 TDF8544TH/N2
Description TDF8544 - I²C-bus controlled 4 x 50 W power amplifier ZIP 27-Pin IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM27, PLASTIC, SOT827-1, DBS-27, Audio/Video Amplifier TDF8544 - I²C-bus controlled 4 x 50 W power amplifier ZIP 27-Pin IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM27, PLASTIC, SOT878-1, RDBS-27, Audio/Video Amplifier TDF8544 - I²C-bus controlled 4 x 50 W power amplifier SOIC 36-Pin IC 51 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO36, PLASTIC,SOT851-1, HSOP-36, Audio/Video Amplifier
Maker NXP NXP NXP NXP NXP NXP
Parts packaging code ZIP SOT ZIP SOT SOIC SOIC
Contacts 27 27 27 27 36 36
Reach Compliance Code unknown unknown unknown unknown unknown unknow
Manufacturer packaging code SOT878-1 SOT827-1 SOT827-1 SOT878-1 SOT851-2 -
package instruction - PLASTIC, SOT827-1, DBS-27 - PLASTIC, SOT878-1, RDBS-27 SSOP, SSOP36,.56 PLASTIC,SOT851-1, HSOP-36
Commercial integrated circuit types - AUDIO AMPLIFIER - AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 code - R-PZFM-T27 - R-PZFM-T27 R-PDSO-G36 R-PDSO-G36
Number of functions - 1 - 1 4 1
Number of terminals - 27 - 27 36 36
Maximum operating temperature - 105 °C - 105 °C 105 °C 105 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - FLANGE MOUNT - FLANGE MOUNT SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Certification status - Not Qualified - Not Qualified Not Qualified Not Qualified
surface mount - NO - NO YES YES
technology - BCDMOS - BCDMOS BCDMOS BCDMOS
Temperature level - INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - THROUGH-HOLE - THROUGH-HOLE GULL WING GULL WING
Terminal location - ZIG-ZAG - ZIG-ZAG DUAL DUAL

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