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ZMD31050AC

Description
Analog Circuit, 1 Func, CMOS, DIE
CategoryAnalog mixed-signal IC    The signal circuit   
File Size387KB,23 Pages
ManufacturerZentrum Mikroelektronik Dresden AG (IDT)
Download Datasheet Parametric Compare View All

ZMD31050AC Overview

Analog Circuit, 1 Func, CMOS, DIE

ZMD31050AC Parametric

Parameter NameAttribute value
MakerZentrum Mikroelektronik Dresden AG (IDT)
Parts packaging codeDIE
package instructionDIE,
Reach Compliance Codeunknown
Analog Integrated Circuits - Other TypesANALOG CIRCUIT
JESD-30 codeX-XUUC-N
Number of functions1
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeUNSPECIFIED
Package formUNCASED CHIP
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formNO LEAD
Terminal locationUPPER
ZMD31050 RB
IC
series
Advanced Differential Sensor Signal Conditioner
Datasheet
Features
Digital compensation of sensor offset, sensitivity,
temperature drift and non-linearity
Accommodates nearly all bridge sensors by PGA
and programmable ADC
Capable with sensor signals from 1 up to
275mV/V span
Sensor connections check and aging detection
Selectable temperature compensation reference:
bridge, thermistor, internal diode or external diode
Output options: voltage (0...5V), current
(4...20mA), PWM, I
2
C, SPI, ZACwire
TM
(one-wire-
interface), alarm
Adjustable output resolution (up to 15 bits) versus
sampling rate (up to 3.9kHz)
Selectable bridge excitation: ratiometric voltage,
constant voltage or constant current
Input channel for separate temperature sensor
Operation temperature -40...+125°C
(-50...+150°C derated)
Supply voltage +2.7V...+5.5V
Available in SSOP16 or as die
PRELIMINARY
Brief Description
The ZMD31050 is a CMOS integrated circuit that
belongs to ZMD’s RB
IC
series. It performs highly-
accurate amplification/scaling and sensor-specific
correction of bridge sensor signals.
Digital compensation of sensor offset, sensitivity,
temperature drift and non-linearity is accomplished via
a 16-bit RISC micro-controller running a correction
algorithm with calibration coefficients stored in non-
volatile EEPROM.
The ZMD31050 accommodates virtually any bridge
sensor (e.g. piezo-resistive, ceramic-thickfilm or steel
membrane based). In addition, the IC can interface a
separate temperature sensor.
The bi-directional digital interfaces (I
2
C, SPI,
ZACwire
TM
) can be used for a simple PC-controlled
calibration, in order to program a set of calibration
coefficients into an on-chip EEPROM. Thus a specific
sensor and a ZMD31050 are mated digitally: fast,
precise and without the cost overhead associated with
laser trimming, or mechanical potentiometer methods.
Application kit available (SSOP16 samples,
calibration PCB, calibration software, technical
documentation)
Support for industrial mass calibration
available
Quick circuit customization possible for large
production volumes
Benefits
No external trimming components required
PC-controlled configuration and calibration via
digital bus interface - simple, low cost
High accuracy (±0.1% FSO @ -25...85°C; ±0.25%
FSO @ -40...125°C)
Application Circuit (Examples)
Fig.1: Ratiometric measurement with voltage output,
temperature compensation via external diode
Fig.2: Two wire 4...20mA (5...40V) configuration.
Temperature compensation via internal diode
Copyright © 2003, ZMD AG, Rev. 0.6.2, 2003-11-18, PRELIMINARY
1/23
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.

ZMD31050AC Related Products

ZMD31050AC ZMD31050AF-S ZMD31050AF-R ZMD31050AB ZMD31050AD ZMD31050AF-T
Description Analog Circuit, 1 Func, CMOS, DIE Analog Circuit, 1 Func, CMOS, PDSO16, 5.30 MM, SOIC-16 Analog Circuit, 1 Func, CMOS, PDSO16, 5.30 MM, SOIC-16 Analog Circuit, 1 Func, CMOS, DIE Analog Circuit, 1 Func, CMOS, DIE Analog Circuit, 1 Func, CMOS, PDSO16, 5.30 MM, SOIC-16
Maker Zentrum Mikroelektronik Dresden AG (IDT) Zentrum Mikroelektronik Dresden AG (IDT) Zentrum Mikroelektronik Dresden AG (IDT) Zentrum Mikroelektronik Dresden AG (IDT) Zentrum Mikroelektronik Dresden AG (IDT) Zentrum Mikroelektronik Dresden AG (IDT)
Parts packaging code DIE SOIC SOIC DIE DIE SOIC
package instruction DIE, SOP, SOP, DIE, DIE, SOP,
Reach Compliance Code unknown compliant compliant unknown unknown compliant
Analog Integrated Circuits - Other Types ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT
JESD-30 code X-XUUC-N R-PDSO-G16 R-PDSO-G16 X-XUUC-N X-XUUC-N R-PDSO-G16
Number of functions 1 1 1 1 1 1
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
encapsulated code DIE SOP SOP DIE DIE SOP
Package shape UNSPECIFIED RECTANGULAR RECTANGULAR UNSPECIFIED UNSPECIFIED RECTANGULAR
Package form UNCASED CHIP SMALL OUTLINE SMALL OUTLINE UNCASED CHIP UNCASED CHIP SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form NO LEAD GULL WING GULL WING NO LEAD NO LEAD GULL WING
Terminal location UPPER DUAL DUAL UPPER UPPER DUAL

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