EEWORLDEEWORLDEEWORLD

Part Number

Search

YTE-103-03-G-5-700

Description
Board Stacking Connector, 15 Contact(s), 5 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT
CategoryThe connector    The connector   
File Size936KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance  
Download Datasheet Parametric View All

YTE-103-03-G-5-700 Overview

Board Stacking Connector, 15 Contact(s), 5 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT

YTE-103-03-G-5-700 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
Objectid1716371348
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
compound_id58867388
Other featuresFLEXYZ
Body/casing typeSOCKET
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD (20) OVER NICKEL (50)
Contact completed and terminatedGOLD (20) OVER NICKEL (50)
Contact point genderFEMALE
Contact materialPHOSPHOR BRONZE
DIN complianceNO
Filter functionNO
IEC complianceNO
JESD-609 codee4
MIL complianceNO
Manufacturer's serial numberYTE
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded5
OptionsGENERAL PURPOSE
Terminal pitch2 mm
Termination typeSOLDER
Total number of contacts15
F-213 SUPPLEMENT
YTE–110–02–G–6–500
YTE–120–03–G–5–700
(2,00 mm) .0787"
TM
YTE–114–03–M–Q–368
YTE SERIES
HIGH DENSITY ELEVATED SOCKET STRIP
SPECIFICATIONS
For complete specifications
see www.samtec.com?YTE
Insulator Material:
Black Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Current Rating:
3A per contact @ 80°C ambient
Operating Temp Range:
-55°C to +105°C
Plating:
Sn or Au over
50µ" (1,27 µm) Ni
Contact Resistance:
10 mΩ
Insertion Depth:
(2,62 mm) .103" to
(5,03 mm) .198" with
(0,38 mm) .015" wipe
Max Cycles:
100 with 10µ" (0,25 µm) Au
Insertion Force:
(Single contact only)
1.8 oz (0,50 N) avg
Withdrawal Force:
(Single contact only)
1.0 oz (0,28 N) avg
RoHS Compliant:
Yes
Lead–Free Solderable:
Wave only
Mates with:
YTT, YTW, YTE
Body Height
from (8,64 mm)
.340" to
(20,32 mm)
.800"
ALSO AVAILABLE
Paste In Hole (PIH) processing.
(Not recommended for self-nesting.)
Contact Samtec ASP Group.
(2,00 mm)
.0787"
pitch
YTE
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
BODY
HEIGHT
OTHER
OPTION
02 thru 50
Note:
This Series is non-standard,
non-returnable.
–G
= 20µ" (0,51 µm) Gold
(Recommended for
self-nesting)
–“XXX”
= Body Height
(in inches)
(8,64 mm) .340"
min. for –Q
(9,53 mm) .375"
min. for –5 & –6
–“XXX”
=Polarized
Position
(Indicate
position
number)
–M
= 20µ" (0,51 µm)
Gold on contact,
Tin on tail
Also Available
PC/104-Plus
Sockets
See ESQT-368
Series.
300
No. of positions x
(2,00) .0787 + (0,30) .012
06
–L
No. of
rows x
(2,00)
.0787
= 10µ" (0,25 µm)
Gold on contact,
Tin on tail
–Q
= Quad Row
Low
Profile
See YTS
& YTQ Series.
–F
= Gold flash on contact,
Tin on tail
–5
= Five Row
295
01
(2,00)
.0787
–6
= Six Row
1, 2, & 3
Row
See ESQT
Series.
(6,35)
.250
A
BODY TAIL
HEIGHT (1,27)
.050
MIN
LEAD
STYLE
MAX MAX BODY
HEIGHT
TAIL
(21,59) (13,72) (20,32)
– 02
.850 .540
.800
(11,63) (3,76)
(10,36)
–03
.458 .148
.408
A
Press Fit
See PTHF
Series.
(0,50)
.020 SQ
(2,00)
.0787
(2,00)
.0787
WWW.SAMTEC.COM
Does s3c2410 support 4G sd card?
Hello experts, have you ever made a 4G SDHC card driver in S3C2410 under WinCE4.2? Is it possible? I am ready to try it. Please give me some advice to avoid detours. I have seen the implementation of ...
wbq315 Embedded System
DSP28335 R&D Notes
[backcolor=white][size=4][color=#000000]1. How can I view the source files included in CCS5.2? And their locations? [/color][/size][/backcolor] [backcolor=white][size=4][color=#000000] [/color][/size]...
fish001 DSP and ARM Processors
DSP development board HX-5509 TMS320VC5509A
DSP development board video tutorial HX-5509 TMS320VC5509A[/font][/color] The development board is normal without any problems (I just ran the example program after buying it, and usually use C6000). ...
epXc Buy&Sell
TI 2013 Power Management Guide (latest)
TI 2013 Power Management Guide (latest) Check out the changes and new things in TI's latest power management in 2013.[b]TI 2013 Power Management Guide (latest) [/b][color=darkred][b] [/b][/color]...
qwqwqw2088 Power technology
Please recommend a HUB chip that is industrial grade and stable!
Please recommend a hub chip, preferably an 8-port one that is industrial grade and stable....
ououbibisky MCU
A command is active and pcb cannot be saved successfully
Big brothers, please show me the way....
图呢是啥 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2007  650  611  1517  284  41  14  13  31  6 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号