BT8071AKPJ datasheet, PDF - EEWORLD Datasheet

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BT8071AKPJ: DescriptionFramer, CMOS, PQCC68,; CategoryWireless rf/communication Telecom circuit; File Size2MB，56 Pages; ManufacturerCONEXANT; Websitehttp://www.conexant.com/

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BT8071AKPJ Overview

Framer, CMOS, PQCC68,

BT8071AKPJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	CONEXANT
Objectid	1425581630
package instruction	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown
compound_id	11502732
JESD-30 code	S-PQCC-J68
JESD-609 code	e0
Number of functions	1
Number of terminals	68
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	FRAMER
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED

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BT8071AKPJ Related Products

	BT8071AKPJ	BT8071AKPQ	BT8071AKG	BT8071AEPJ
Description	Framer, CMOS, PQCC68,	Framer, CMOS, PQIP64,	Framer, CMOS, CPGA69,	Framer, CMOS, PQCC68,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	QCCJ, LDCC68,1.0SQ	QIP, QUIP64A,.7/.9	PGA, PGA68,11X11	QCCJ, LDCC68,1.0SQ
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-J68	R-PQIP-T64	S-CPGA-P69	S-PQCC-J68
JESD-609 code	e0	e0	e0	e0
Number of functions	1	1	1	1
Number of terminals	68	64	69	68
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	QCCJ	QIP	PGA	QCCJ
Encapsulate equivalent code	LDCC68,1.0SQ	QUIP64A,.7/.9	PGA68,11X11	LDCC68,1.0SQ
Package shape	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	CHIP CARRIER	IN-LINE	GRID ARRAY	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	FRAMER	FRAMER	FRAMER	FRAMER
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	PIN/PEG	J BEND
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	QUAD	QUAD	PERPENDICULAR	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	CONEXANT	CONEXANT	-	CONEXANT

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