MT58LC64K18C4EJ-8P datasheet, PDF

MT58LC64K18C4EJ-8P: DescriptionStandard SRAM, 64KX18, 8ns, CMOS, PQCC52, 19.10 X 19.10 MM, PLASTIC, LCC-52; Categorystorage storage; File Size549KB，15 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT58LC64K18C4EJ-8P Overview

Standard SRAM, 64KX18, 8ns, CMOS, PQCC52, 19.10 X 19.10 MM, PLASTIC, LCC-52

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	LCC
package instruction	19.10 X 19.10 MM, PLASTIC, LCC-52
Contacts	52
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	8 ns
Other features	BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE
I/O type	COMMON
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
length	19.1262 mm
memory density	1179648 bit
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of ports	1
Number of terminals	52
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX18
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.002 A
Minimum standby current	3.14 V
Maximum slew rate	0.21 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.1262 mm

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