SURFACE MOUNT DISPLAY
APBC02-41MWFA
WHITE
Features
!
0.2INCH
Description
The source color devices are made with GaN on SiC
Light Emitting Diode.
Static electricity and surge damage the LEDS. It is
recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
DIGIT HEIGHT.
!
LOW CURRENT OPERATION.
!
EXCELLENT
CHARACTER APPEARANCE.
!
I.C. COMPATIBLE
!
MECHANICALLY RUGGED.
!
GRAY
FACE, YELLOW FLUORESCENT SEGMENT.
!
PACKAGE:1000PCS/REEL
Package Dimensions & Internal Circuit Diagram
D
i
g
i
t
a
l
l
y
s
i
g
n
e
d
b
y
N
e
n
u
p
h
a
r
c
n
=
N
e
n
u
p
h
a
r
,
o
u
=
d
3
e
,
o
=
d
i
s
p
l
a
y
,
c
=
C
N
D
a
t
e
:
2
0
0
3
.
0
3
.
3
1
0
9
:
0
1
:
0
8
+
0
8
'0
0
'R
e
a
s
o
n
:
D
o
c
u
m
e
n
t
i
s
c
e
r
t
i
f
i
e
d
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
±0.25(0.01")unless
otherwise noted.
2. Specifications are subject to change without notice.
SPEC NO: DSAD1484
APPROVED:J.LU
REV NO: V.1
CHECKED: Joe Lee
DATE: MAR/30/2003
DRAWN: F.Y.YUAN
PAGE: 1 OF 4
Selection Guide
Iv (u c d )
@ 20 m A
Min .
APBC02-41MWFA
WHITE (GaN)
YELLOW FLUORESCENT
1600
Ty p .
8700
Common Cathode, Rt. Hand
Decimal
P ar t N o .
Dic e
L en s Ty p e
D es c r i p t i o n
Electrical / Optical Characteristics at T
A
=25°C
°
Sy m b o l
V
F
I
R
X
Chromaticity Coordinates
Y
C
Capacitance
White
White
0.34
100
-
-
-
pF
-
V
F
=0V, f =1MHz
P ar am et er
Forward Voltage
Reverse Current
White
White
D ev i c e
Ty p .
3.8
-
0.33
Max .
4.5
10
-
Un its
V
uA
-
Tes t Co n d it io n s
I
F
=20mA
V
R
= 5V
-
Absolute Maximum Ratings at T
A
=25°C
°
P ar am et er
Power dissipation
DC Forward Current
Forward Current (Peak) [1]
Reverse Voltage
Operating Temperature
Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Wh it e
105
30
150
5
-40
°
C To +85
°C
-40
°
C To +85
°C
Un its
mW
mA
mA
V
SPEC NO: DSAD1484
APPROVED:J.LU
REV NO: V.1
CHECKED: Joe Lee
DATE: MAR/30/2003
DRAWN: F.Y.YUAN
PAGE: 2 OF 4
White
APBC02-41MWFA
APBC02-41MWFA
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO: DSAD1484
APPROVED:J.LU
REV NO: V.1
CHECKED: Joe Lee
DATE: MAR/30/2003
DRAWN: F.Y.YUAN
PAGE: 3 OF 4
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