Multiplier, TTL, PDIP40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Objectid | 100620595 |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| compound_id | 182035296 |
| JESD-30 code | R-PDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER |
| AM25S557PCB | AM25S558DCB | AM25S558DCTB | AM25S558DCT | AM25S558PCB | AM25S558/BUA | AM25S557DMB | |
|---|---|---|---|---|---|---|---|
| Description | Multiplier, TTL, PDIP40 | Multiplier, TTL, CDIP40 | Multiplier, TTL, CDIP40 | Multiplier, TTL, CDIP40 | Multiplier, TTL, PDIP40 | Multiplier, TTL | Multiplier, TTL, CDIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCN, LCC(UNSPEC) | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknow | unknow | unknow | unknow | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | QCCN | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LCC(UNSPEC) | DIP40,.6 |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| surface mount | NO | NO | NO | NO | NO | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER |
| JESD-30 code | R-PDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-PDIP-T40 | - | R-XDIP-T40 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | - | 40 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |
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