Security & Chip Card ICs
SLE 66CL160S
16-Bit High Security Dual Interface Controller
in 0.6 µm CMOS Technology
32-Kbyte ROM, 1280-byte RAM, 16-Kbyte EEPROM
112-Bit / 163-Bit DDES-EC2 Accelerator
Short Product Information
November 2001
SLE 66CL160S Short Product Information
Revision History:
Page
all
editorial changes
Current Version 2001-11-26
Previous Releases: 06.00
Ref.: SPI_SLE66CL160S_1101.doc
Important:
Further information is confidential and on request. Please contact:
Infineon Technologies AG in Munich, Germany,
Security & Chip Card ICs,
Tel +49 - (0)89 234-80000
Fax +49 - (0)89 234-81000
E-Mail: security.chipcard.ics@infineon.com
Published by Infineon Technologies AG, CC Applications Engineering Group
St.-Martin-Strasse 53, D-81541 München
© Infineon Technologies AG 2001
All Rights Reserved.
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SLE 66CL160S
16-Bit High Security Dual Interface Controller in 0.6 µm CMOS Technology
32-Kbyte ROM, 1280-byte RAM, 16-Kbyte EEPROM
112-Bit / 163-Bit DDES-EC2 Accelerator
Features
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16-bit microcomputer in 0.6 µm
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CMOS technology
Instruction set opcode compatible with
standard 8051 processor
Enhanced 16-bit arithmetic
Additional powerful instructions
optimized for chip card applications
Dedicated, non-standard architecture
with
execution time 6 times faster
than standard 8051 processor at same
external clock
31.5 Kbytes User ROM
for application
programs
512 bytes ROM for Resource
Management System (RMS) with
intelligent EEPROM write/erase
routines
16 Kbytes EEPROM
1 Kbytes XRAM, 256 bytes internal
RAM
True Random Number Generator
Dual Key Triple DES (DDES) and
GF (2
n
) Elliptic Curve (EC2)
Accelerator
CRC Module
Interrupt Module
Two 16-bit Autoreload Timer with 8-bit
prescaler
Power saving sleep mode
Temperature range: -25°C to +70°C
•
Programming time adaptable to clock
frequency
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Minimum of 500.000 write/erase
cycles
1)
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Data retention for a minimum of 10
years
1)
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EEPROM programming voltage
generated on chip
Full operation either via Contact-based
or Contactless interface controlled by
Operating System
Contact-based Interface
•
Contact configuration and serial
interface according to ISO/IEC 7816
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Supply voltage range: 2.7 V to 5.5 V
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Current consumption < 10 mA @
5 MHz and 5.5 V
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CPU clock frequency: 1 to 5 MHz
(internal clock = external clock)
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I/O routines realized in software
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ESD protection larger than 4 kV (ISO
pads)
Contactless Interface
•
Interface according to ISO/IEC 14443
for both Type A and Type B
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Carrier frequency 13.56 MHz
•
Data rate 106 Kbit/s for both types
•
Anticollision and Transmission Protocol
supported by software
•
Internal CPU clock frequency:
1.13 MHz (f
C
/12) to 3.39 MHz (f
C
/4)
•
127 bytes buffer for data exchange
(FiFo circular architecture)
1)
EEPROM
•
Reading, erasing and writing byte by
byte
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Flexible page mode for 1 to 64 bytes
write/erase operation
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32 bytes security area
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Write time 3.6 ms, erase time 1.8 ms
Short Product Information
3/8
Values are temperature dependant
2001-11-26
SLE 66CL160S
Security Features
Operation state monitoring
mechanism
•
Low and high voltage sensors
•
Frequency sensors and filters
Memory Security
•
ROM code not visible due to
implantation
•
Internal power-on reset
•
16 bytes security PROM, hardware
protected
•
Unique chip identification number for
each chip
•
Security optimized layout and layout
scrambling
•
MED – memory encryption/decryption
device for XRAM, ROM and EEPROM
•
True Random Number Generator with
Firmware test function
•
User settable additional encryption key
for EEPROM
•
Move code blocking (from EEPROM)
•
Additional security features
Anti Snooping
•
HW-countermeasures against
SPA/DPA-, Timing- and DFA-attacks
(differential fault analysis)
•
Non standard dedicated Smart Card
CPU-Core
Supported Standards
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ISO/IEC 7816
•
EMV 2000
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GSM 11.1x
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ETSI TS 102 221
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ISO/IEC 14443
Support
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HW-& SW-Tools (Emulator, ROM
Monitor, Card Emulator, Simulator,
Contactless Reader EVA Kit,
SmartMask™)
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Application notes (e.g.: T=0, T=1, DES,
contactless transmission protocol, etc.)
Document References
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Confidential Data Book SLE 66CxxS
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Confidential Instruction SLE 66CxxS
•
Confidential Quick Reference
SLE 66CxxS
•
Chip Qualification Report
•
Chip delivery specification for wafer
with chip-layout (die size,
orientation,...)
•
Module specification containing
description of package, etc.
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Module Qualification report
Development Tools Overview
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Software Development Kit SDK CC
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Card Emulator SCE66
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ROM Monitor SRM66
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Emulator SET66 Hitex or SET66 KSC
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Smart Mask™ Package
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Contactless Reader EVA Kit
Short Product Information
4/8
2001-11-26
SLE 66CL160S
Performance DDES-EC2 Accelerator
Operation
Data Block
Length
Encryption Time for an
8-Byte Block including
Data Transfer
5 MHz
56-bit Single DES Encryption
112-bit Triple DES Encryption
64 bit
64 bit
Operand
Length
Elliptic Curves GF(2
n
) EC-DSA Signature Generate
Elliptic Curves GF(2
n
) EC-DSA Signature Verify
163 bit
163 bit
23 µs
35 µs
Calculation Time
5 MHz
436 ms
1017 ms
Table 1
Type
Ordering Information
Package
M8.4
C
2.7 V - 5.5 V
– 25°C to + 85°C 1 MHz – 5 MHz
Voltage Range Temperature
Range
2.7 V - 5.5 V
Frequency
Range
SLE 66CL160S – M8.4
SLE 66CL160S – C
– 25°C to + 70°C 1 MHz – 5 MHz
SLE 66CL160S – T85-M8.4 M8.4
SLE 66CL160S – T85-C
C
Production sites:
•
Regensburg SLE 66CxxS
Short Product Information
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2001-11-26