The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 17 July 2013.
INCH-POUND
MIL-PRF-19500/601K
17 April 2013
SUPERSEDING
MIL-PRF-19500/601J
14 March 2012
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, FIELD EFFECT POWER
TRANSISTORS, N-CHANNEL, SILICON, TYPES 2N7261 AND 2N7262 U AND U5 SUFFIXES, JANTXV,
AND RADIATION HARDENED TYPE SUFFIXES, JANTXVR, F, G, AND H AND JANSR, F, G, AND H
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and
MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for an N-channel, enhancement-mode,
MOSFET, radiation hardened and non-hardened, power transistors. Two levels of product assurance are provided
for each device type as specified in
MIL-PRF-19500,
with avalanche energy maximum rating (E
AS
) and maximum
avalanche current (I
AS
). See
6.5
for JANHC and JANKC die versions.
1.2 Physical dimensions. See
figure 1
(TO-205AF) and
figure 2
(LCC).
1.3 Maximum ratings. Unless otherwise specified, T
A
= +25°C.
Type
(1)
R
θJC
(3)
R
θJA
T
J
and
T
STG
*
P
T
(2)
P
T
T
C
= +25°C T
A
= +25°C
(free air)
W
W
0.71
0.71
V
DS
and
V
DG
V
GS
I
D1
I
D2
(4) (5)
(4) (5)
T
C
= +25°C T
C
= +100°C
I
S
I
DM
(6)
°C/W
5.0
5.0
°C/W
175
175
V dc
100
200
V dc
±20
±20
A dc
8.0
5.5
A dc
5.0
3.5
A dc
8.0
5.5
A(pk)
32
22
°C
-55 to +150
-55 to +150
2N7261
2N7262
25
25
(1) Unless otherwise specified, electrical characteristics, ratings, and conditions for “U” and “U5” suffix devices
(surface mount LCC) are identical to the corresponding non “U” and “U5” suffix devices.
(2) Derate linearly 0.2 W/°C for T
C
> +25°C.
(3) See
figure 3,
thermal impedance curves.
(4) The following formula derives the maximum theoretical I
D
limit. I
D
is limited by package and internal wires
and may be limited by pin diameter:
T
JM
- T
C
I
D
=
(
R
θ
JC
)
x
(
R
DS
( on ) at T
JM
)
(5) See
figure 4,
maximum drain current graph.
(6) I
DM
= 4 X I
D1
as calculated in note (4).
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dla.mil.
Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at
https://assist.dla.mil/.
AMSC N/A
FSC 5961
MIL-PRF-19500/601K
Ltr
Inches
Min
CD
CH
HD
LC
LD
LL
LU
L
1
L
2
P
Q
r
TL
TW
α
Term 1
Term 2
Term 3
.029
.028
.250
.070
.315
.160
.340
Dimensions
Millimeters
Min
8.00
4.07
8.64
Max
9.01
4.57
9.40
Max
.355
.180
.370
.200 BSC
.016
.500
.016
.021
.750
.019
.050
5.08 BSC
0.41
12.70
0.41
0.53
19.05
0.48
1.27
6.35
1.78
.050
.010
.045
.034
0.74
0.71
1.27
0.25
1.14
0.86
45° BSC
Source
Gate
Drain
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Lead number 1 is the source, lead number 2 is the gate, lead 3 is the drain and is electrically connected to the
case, lead number 4 is omitted from this outline.
4. Dimensions and tolerancing shall be in accordance with ASME Y14.5M.
FIGURE 1. Physical dimensions for TO-205AF (2N7261 and 2N7262).
2
MIL-PRF-19500/601K
18
1
FIGURE 2. Physical dimensions for LCC (2N7261U, 2N7261U5, 2N7262U, and 2N7262U5).
3
MIL-PRF-19500/601K
Symbol
Inches
Min
BL
BW
CH
LL
1
LL
2
LS
LS
1
LS
2
LW
Q
1
Q
2
Q
3
TL
TW
.345
.280
.095
.040
.055
Dimensions
Millimeters
Min
8.77
7.11
2.41
1.02
1.40
Max
9.14
7.49
2.92
1.40
1.65
Max
.360
.295
.115
.055
.065
.059 BSC
.025 BSC
.008 BSC
.020
.030
1.50 BSC
0.635 BSC
0.203 BSC
0.51
0.76
.105 REF
.120 REF
.045
.070
.120
.055
.080
.130
2.67 REF
3.05 REF
1.14
1.78
3.05
1.40
2.03
3.30
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions and tolerancing shall be in accordance with ASME Y14.5M.
4. The U5 suffix is the preferred suffix designation for this LCC package.
FIGURE 2. Physical dimensions for LCC (2N7261U, 2N7261U5, 2N7262U, and 2N7262U5) - Continued.
4
MIL-PRF-19500/601K
1.4 Primary electrical characteristics at T
C
= +25°C.
Type
(1)
Min
V
(BR)DSS
V
GS
= 0
I
D
= 1.0
mA dc
V
GS(TH)
V
DS
≥
V
GS
I
D
= 1.0
mA dc
Max I
DSS1
V
GS
= 0
V
DS
= 80
percent of
rated V
DS
Max r
DS(ON)
(2)
VGS = 12 V dc
E
AS
at I
D1
I
AS
T
J
= +25°C
at I
D2
T
J
= +150°C
at I
D2
V dc
V dc
Min
Max
4.0
4.0
µA
dc
ohm
ohm
mJ
A
2N7261
2N7262
100
200
2.0
2.0
25
25
0.180
0.350
0.390
0.840
130
240
8.0
5.5
(1) Unless otherwise specified, electrical characteristics, ratings, and conditions for “U” and “U5” suffix devices
(surface mount LCC) are identical to the corresponding non “U” and “U5” suffix devices.
(2) Pulsed (see
4.5.1).
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or
https://assist.dla.mil/
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
5
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