K7P401823B-H65000 datasheet, PDF

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K7P401823B-H65000: DescriptionStandard SRAM, 256KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119; Categorystorage storage; File Size411KB，13 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7P401823B-H65000 Overview

Standard SRAM, 256KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119

K7P401823B-H65000 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
Objectid	1976775912
Parts packaging code	BGA
package instruction	BGA,
Contacts	119
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
compound_id	9914356
Maximum access time	6.5 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B119
length	22 mm
memory density	4718592 bit
Memory IC Type	STANDARD SRAM
memory width	18
Number of functions	1
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX18
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.45 V
Minimum supply voltage (Vsup)	3.15 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	14 mm

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K7P403623B

K7P401823B

Document Title

128Kx36 & 256Kx18 Synchronous Pipelined SRAM

Preliminary

128Kx36 & 256Kx18 SRAM

Revision History

Rev. No.

Rev. 0.0

Rev. 0.1

History

- Preliminary specification release

- Update DC CHARACTERISTICS

x36 : I

DD6

: TBD -> 300, I

DD65

-> 290, I

DD7

-> 280.

x18 : I

DD6

: TBD -> 290, I

DD65

-> 280, I

DD7

-> 270.

- Change simbol in DC CHARACTERISTICS

DD6

, I

DD65

, I

DD7

-> I

DD65

, I

DD70

, I

DD75

Draft Date

Oct. 2002

Jan. 2003

Remark

Preliminary

Feb. 2003

Rev. 0.2

Preliminary

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.

-1-

Feb. 2003

Rev 0.2

K7P401823B-H65000 Related Products

	K7P401823B-H65000	K7P403623B-H75000	K7P403623B-H70000	K7P403623B-H65000	K7P401823B-H70000	K7P401823B-H75000
Description	Standard SRAM, 256KX18, 6.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119	Standard SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119	Standard SRAM, 128KX36, 7ns, CMOS, PBGA119, 14 X 22 MM, BGA-119	Standard SRAM, 128KX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119	Standard SRAM, 256KX18, 7ns, CMOS, PBGA119, 14 X 22 MM, BGA-119	Standard SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	119	119	119	119	119	119
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	6.5 ns	7.5 ns	7 ns	6.5 ns	7 ns	7.5 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
length	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
memory density	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	18	36	36	36	18	18
Number of functions	1	1	1	1	1	1
Number of terminals	119	119	119	119	119	119
word count	262144 words	131072 words	131072 words	131072 words	262144 words	262144 words
character code	256000	128000	128000	128000	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX18	128KX36	128KX36	128KX36	256KX18	256KX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
Minimum supply voltage (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

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