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BZT52C36LP

Description
Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes
File Size77KB,5 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
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BZT52C36LP Overview

Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

BZT52C2V4LP - BZT52C39LP
SURFACE MOUNT ZENER DIODE
Features
Ultra-Small Leadless Surface Mount Package
Ideally Suited for Automated Assembly Processes
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Marking Information
Terminals: Finish
NiPdAu Over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.001 grams (Approximate)
Bottom View
Ordering Information
(Note 3)
Part Number
(Type Number)-7*
(Type Number)-7B**
Case
X1-DFN1006-2
X1-DFN1006-2
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7.
**Add “-7B” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7B.
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
BZT52CxxLP-7B
BZT52CxxLP-7
xx
Top View
Bar Denotes
Cathode Side
xx
Top View
Dot Denotes
Cathode Side
xx = Product Type Marking Code
BZT52C2V4LP - BZT52C39LP
Document number: DS30506 Rev. 18 - 2
1 of 5
www.diodes.com
September 2011
© Diodes Incorporated

BZT52C36LP Related Products

BZT52C36LP BZT52C36LP-7
Description Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes

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