K8A3215EBE-FC7C datasheet, PDF

K8A3215EBE-FC7C: DescriptionFlash, 2MX16, 80ns, FBGA; Categorystorage storage; File Size604KB，38 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K8A3215EBE-FC7C Overview

Flash, 2MX16, 80ns, FBGA

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	BGA,
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	80 ns
JESD-30 code	R-PBGA-B
JESD-609 code	e0
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED

K8A3215ET(B)E

NOR FLASH MEMORY

32Mb E-die NOR Specification

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AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

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ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

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Revision 1.1

September, 2006

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