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IBM0116405BT1-60

Description
EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 X 0.675 INCH, TSOP2-26/24
Categorystorage    storage   
File Size373KB,31 Pages
ManufacturerIBM
Websitehttp://www.ibm.com
Download Datasheet Parametric View All

IBM0116405BT1-60 Overview

EDO DRAM, 4MX4, 60ns, CMOS, PDSO24, 0.300 X 0.675 INCH, TSOP2-26/24

IBM0116405BT1-60 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIBM
Parts packaging codeTSOP2
package instructionTSOP2, TSOP24/26,.36
Contacts26
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-PDSO-G24
JESD-609 codee0
length17.14 mm
memory density16777216 bit
Memory IC TypeEDO DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals24
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSOP24/26,.36
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
self refreshNO
Maximum standby current0.001 A
Maximum slew rate0.075 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Discontinued (9/98 - last order; 3/99 last ship)
IBM01164054M x 412/10, 5.0V, EDOMMDD62DSU-001015231. IBM0116405P4M x 412/10, 3.3V, EDO, LP, SRMMDD62DSU-001015231. IBM0116405M4M x 412/10, 5.0V, EDO, LP, SRMMDD62DSU-001015231. IBM0116405B4M x 412/10, 3.3V, EDOMMDD62DSU-001015231.
IBM0116405 IBM0116405M
IBM0116405B IBM0116405P
4M x 4 12/10 EDO DRAM
Features
• 4,194,304 word by 4 bit organization
• Single 3.3V
±
0.3V or 5.0V
±
0.5V power supply
• Standard Power (SP) and Low Power (LP)
• 4096 Refresh Cycles
- 64 ms Refresh Rate (SP version)
- 256 ms Refresh Rate (LP version)
• High Performance:
-50
t
RAC
RAS Access Time
t
CAC
CAS Access Time
t
AA
t
RC
Column Address Access Time
Cycle Time
50
13
25
84
20
-60
60
15
30
104
25
Units
ns
ns
ns
ns
ns
• Low Power Dissipation
- Active (max) - 55 mA / 50 mA
- Standby: TTL Inputs (max) - 1.0 mA
- Standby: CMOS Inputs (max)
- 1.0 mA (SP version)
- 0.1 mA (LP version)
- Self Refresh (LP version only)
- 200µA (3.3 Volt)
- 300µA (5.0 Volt)
• Extended Data Out (Hyper Page) Mode
• Read-Modify-Write
• RAS Only and CAS before RAS Refresh
• Hidden Refresh
• Package: SOJ 26/24 (300milx675mil)
TSOP-26/24 (300milx675mil)
t
HPC
EDO (Hyper Page) Mode Cycle Time
Description
The IBM0116405 is a dynamic RAM organized
4,194,304 words by 4 bits, which has a very low
“sleep mode” power consumption option. These
devices are fabricated in IBM’s advanced 0.5µm
CMOS silicon gate process technology. The circuit
and process have been carefully designed to pro-
vide high performance, low power dissipation, and
high reliability. The devices operate with a single
3.3V
±
0.3V or 5.0V
±
0.5V power supply. The 22
addresses required to access any bit of data are
multiplexed (12 are strobed with RAS, 10 are
strobed with CAS).
Pin Assignments
(Top View)
Vcc
I/O0
I/O1
WE
RAS
A11
Pin Description
RAS
Row Address Strobe
Column Address Strobe
Read/Write Input
Address Inputs
Output Enable
Data Input/Output
Power (+3.3V or +5.0V)
Ground
CAS
WE
A0 - A11
OE
I/O0 - I/O3
V
CC
V
SS
1
2
3
4
5
6
26
25
24
23
22
21
Vss
I/O3
I/O2
CAS
OE
A9
A10
A0
A1
A2
A3
Vcc
8
9
10
11
12
13
19
18
17
16
15
14
A8
A7
A6
A5
A4
Vss
28H4720
SA14-4226-06
Revised 4/97
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
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