IS27HC256-55CW datasheet, PDF - EEWORLD Datasheet

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IS27HC256-55CW: DescriptionUVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28; Categorystorage storage; File Size327KB，10 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS27HC256-55CW Overview

UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28

IS27HC256-55CW Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Objectid	1412440771
Parts packaging code	DIP
package instruction	0.600 INCH, WINDOWED, CERAMIC, DIP-28
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
compound_id	9653245
Maximum access time	55 ns
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
memory density	262144 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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Description	UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	OTP ROM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 32KX8, 45ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	OTP ROM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 32KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 32KX8, 45ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28	UVPROM, 32KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28	0.600 INCH, WINDOWED, CERAMIC, DIP-28
Contacts	28	28	28	28	28	28	28	28	28
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	55 ns	45 ns	70 ns	70 ns	70 ns	45 ns	45 ns	55 ns
JESD-30 code	R-GDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	UVPROM	OTP ROM	OTP ROM	OTP ROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28
word count	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	85 °C	85 °C	70 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-40 °C	-40 °C
organize	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	WDIP	DIP	DIP	DIP	WDIP	WDIP	WDIP	WDIP	WDIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	IN-LINE	IN-LINE	IN-LINE	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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