MF10BN datasheet, PDF - EEWORLD Datasheet

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MF10BN: DescriptionIC,FILTER,AP/BP/HP/LP/NOTCH,CMOS,DIP,20PIN,PLASTIC; CategoryAnalog mixed-signal IC filter; File Size1MB，21 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MF10BN Overview

IC,FILTER,AP/BP/HP/LP/NOTCH,CMOS,DIP,20PIN,PLASTIC

MF10BN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Objectid	1435199970
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
compound_id	167271286
Active filter type	SWITCHED CAPACITOR FILTER
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
Number of functions	2
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Order	2ND
Package body material	PLASTIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
response	AP/BP/HP/LP/NOTCH
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
transfer characteristics	BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV

MF10BN Related Products

	MF10BN	MF10CN	MF10CN/B+	MF10BN/B+
Description	IC,FILTER,AP/BP/HP/LP/NOTCH,CMOS,DIP,20PIN,PLASTIC	IC,FILTER,AP/BP/HP/LP/NOTCH,CMOS,DIP,20PIN,PLASTIC	IC,FILTER,AP/BP/HP/LP/NOTCH,CMOS,DIP,20PIN,PLASTIC	IC,FILTER,AP/BP/HP/LP/NOTCH,CMOS,DIP,20PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknow
Active filter type	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER
JESD-30 code	R-PDIP-T20	R-PDIP-T20	R-PDIP-T20	R-PDIP-T20
JESD-609 code	e0	e0	e0	e0
Number of functions	2	2	2	2
Number of terminals	20	20	20	20
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Order	2ND	2ND	2ND	2ND
Package body material	PLASTIC	PLASTIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
response	AP/BP/HP/LP/NOTCH	AP/BP/HP/LP/NOTCH	UNIVERSAL	UNIVERSAL
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
transfer characteristics	BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV	BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV	BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV	BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV

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