KM23C8100AG-20 datasheet, PDF - EEWORLD Datasheet

KM23C8100AG-20: DescriptionMASK ROM, 1MX8, 200ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44; Categorystorage storage; File Size55KB，1 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM23C8100AG-20 Overview

MASK ROM, 1MX8, 200ns, CMOS, PDSO44, 0.600 INCH, PLASTIC, SOP-44

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	SOIC
package instruction	SOP, SOP44,.63
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	200 ns
Spare memory width	8
JESD-30 code	R-PDSO-G44
JESD-609 code	e0
length	28.5 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	44
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP44,.63
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.1 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12.6 mm

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