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K7N801849A-HC20T

Description
ZBT SRAM, 512KX18, 3.2ns, CMOS, PBGA119
Categorystorage    storage   
File Size457KB,20 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

K7N801849A-HC20T Overview

ZBT SRAM, 512KX18, 3.2ns, CMOS, PBGA119

K7N801849A-HC20T Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
package instructionBGA, BGA119,7X17,50
Reach Compliance Codeunknown
Maximum access time3.2 ns
Maximum clock frequency (fCLK)200 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width18
Humidity sensitivity level3
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5 V
Certification statusNot Qualified
Maximum standby current0.01 A
Minimum standby current2.38 V
Maximum slew rate0.41 mA
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
K7N803649A
K7N801849A
Document Title
PRELIMINARY
256Kx36 & 512Kx18 Pipelined NtRAM
TM
256Kx36 & 512Kx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
History
1. Initial document.
Add 119BGA(7x17 Ball Grid Array Package)
Draft Date
May. 24. 2000
July. 03. 2000
Remark
Preliminary
Preliminary
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
July 2000
Rev 0.1

K7N801849A-HC20T Related Products

K7N801849A-HC20T K7N803649A-HC22T K7N803649A-HC18T
Description ZBT SRAM, 512KX18, 3.2ns, CMOS, PBGA119 ZBT SRAM, 256KX36, 2.8ns, CMOS, PBGA119 ZBT SRAM, 256KX36, 3.3ns, CMOS, PBGA119
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
package instruction BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50
Reach Compliance Code unknown unknown unknown
Maximum access time 3.2 ns 2.8 ns 3.3 ns
Maximum clock frequency (fCLK) 200 MHz 225 MHz 183 MHz
I/O type COMMON COMMON COMMON
JESD-30 code R-PBGA-B119 R-PBGA-B119 R-PBGA-B119
JESD-609 code e0 e0 e0
memory density 9437184 bit 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 36 36
Humidity sensitivity level 3 3 3
Number of terminals 119 119 119
word count 524288 words 262144 words 262144 words
character code 512000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 512KX18 256KX36 256KX36
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum standby current 0.01 A 0.01 A 0.01 A
Minimum standby current 2.38 V 2.38 V 2.38 V
Maximum slew rate 0.41 mA 0.45 mA 0.38 mA
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40 40
Maker SAMSUNG - SAMSUNG
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