L29C520SC22 datasheet, PDF - EEWORLD Datasheet

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L29C520SC22: DescriptionPipeline Register, 8-Bit, CMOS, PDSO24, 0.209 INCH, PLASTIC, SSOP-24; CategoryThe embedded processor and controller Microcontrollers and processors; File Size734KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L29C520SC22 Overview

Pipeline Register, 8-Bit, CMOS, PDSO24, 0.209 INCH, PLASTIC, SSOP-24

L29C520SC22 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	SSOP
package instruction	SSOP, SSOP24,.3
Contacts	24
Reach Compliance Code	unknown
Other features	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
boundary scan	NO
External data bus width	8
JESD-30 code	R-PDSO-G24
JESD-609 code	e0
length	8.2 mm
low power mode	NO
Humidity sensitivity level	3
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Output data bus width	8
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP24,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2 mm
Maximum slew rate	30 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5.3 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER

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L29C520SC22 Related Products

	L29C520SC22	L29C520SC14	L29C521PC14	L29C520JC14	L29C520PC14
Description	Pipeline Register, 8-Bit, CMOS, PDSO24, 0.209 INCH, PLASTIC, SSOP-24	Pipeline Register, 8-Bit, CMOS, PDSO24, 0.209 INCH, PLASTIC, SSOP-24	Pipeline Register, 8-Bit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	Pipeline Register, 8-Bit, CMOS, PQCC28, PLASTIC, LCC-28	Pipeline Register, 8-Bit, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SSOP	SSOP	DIP	QLCC	DIP
package instruction	SSOP, SSOP24,.3	SSOP, SSOP24,.3	DIP, DIP24,.3	QCCJ, LDCC28,.5SQ	DIP, DIP24,.3
Contacts	24	24	24	28	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
Other features	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ	MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ
boundary scan	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8
JESD-30 code	R-PDSO-G24	R-PDSO-G24	R-PDIP-T24	S-PQCC-J28	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0
length	8.2 mm	8.2 mm	30.861 mm	11.5062 mm	30.861 mm
low power mode	NO	NO	NO	NO	NO
Humidity sensitivity level	3	3	3	3	3
Number of terminals	24	24	24	28	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
Output data bus width	8	8	8	8	8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SSOP	DIP	QCCJ	DIP
Encapsulate equivalent code	SSOP24,.3	SSOP24,.3	DIP24,.3	LDCC28,.5SQ	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	IN-LINE	CHIP CARRIER	IN-LINE
Peak Reflow Temperature (Celsius)	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2 mm	2 mm	4.572 mm	4.572 mm	4.572 mm
Maximum slew rate	30 mA	30 mA	30 mA	30 mA	30 mA
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	0.65 mm	0.65 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	5.3 mm	5.3 mm	7.62 mm	11.5062 mm	7.62 mm
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER	DSP PERIPHERAL, PIPELINE REGISTER
Maker	LOGIC Devices	-	LOGIC Devices	LOGIC Devices	LOGIC Devices

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