|
MT8LD264G-7X |
MT8LD264G-6X |
MT8LD264G-6 |
MT8LD264G-7 |
| Description |
EDO DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 |
EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 |
Fast Page DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 |
Fast Page DRAM Module, 2MX64, 70ns, CMOS, DIMM-168 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
DIMM |
DIMM |
DIMM |
DIMM |
| package instruction |
DIMM-168 |
DIMM-168 |
DIMM-168 |
DIMM-168 |
| Contacts |
168 |
168 |
168 |
168 |
| Reach Compliance Code |
unknown |
not_compliant |
not_compliant |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| access mode |
FAST PAGE WITH EDO |
FAST PAGE WITH EDO |
FAST PAGE |
FAST PAGE |
| Maximum access time |
70 ns |
60 ns |
60 ns |
70 ns |
| Other features |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| Spare memory width |
32 |
32 |
32 |
32 |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
R-XDMA-N168 |
R-XDMA-N168 |
R-XDMA-N168 |
R-XDMA-N168 |
| memory density |
134217728 bit |
134217728 bit |
134217728 bit |
134217728 bit |
| Memory IC Type |
EDO DRAM MODULE |
EDO DRAM MODULE |
FAST PAGE DRAM MODULE |
FAST PAGE DRAM MODULE |
| memory width |
64 |
64 |
64 |
64 |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of ports |
1 |
1 |
1 |
1 |
| Number of terminals |
168 |
168 |
168 |
168 |
| word count |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
| character code |
2000000 |
2000000 |
2000000 |
2000000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
2MX64 |
2MX64 |
2MX64 |
2MX64 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
DIMM |
DIMM |
DIMM |
DIMM |
| Encapsulate equivalent code |
DIMM168 |
DIMM168 |
DIMM168 |
DIMM168 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) |
225 |
225 |
225 |
225 |
| power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| refresh cycle |
2048 |
2048 |
2048 |
2048 |
| Maximum seat height |
25.654 mm |
25.654 mm |
25.654 mm |
25.654 mm |
| self refresh |
NO |
NO |
NO |
NO |
| Maximum standby current |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
| Maximum slew rate |
0.96 mA |
1.04 mA |
1.04 mA |
0.96 mA |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
NO |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |