EMS21HKF-173.000M
Series
RoHS Compliant (Pb-free) 4 Pad 3.2mm x 5mm SMD
1.8Vdc LVCMOS MEMS Spread Spectrum Oscillator
Frequency Tolerance/Stability
±50ppm Maximum over -40°C to +85°C
Output Control Function
Spread Disable (Spread Spectrum On Output Disabled)
RoHS
Pb
EMS21 H K F -173.000M
Nominal Frequency
173.000MHz
Spread Spectrum
-2.00% Down Spread
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
173.000MHz
±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, 260°C Reflow, Shock, and Vibration)
±1ppm Maximum First Year
1.8Vdc ±5%
-0.5Vdc to +1.98Vdc
35mA Maximum (Unloaded; Nominal Vdd)
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
2nSec Maximum (Measured from 20% to 80% of waveform)
50 ±10(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Spread Disable (Spread Spectrum On Output Disabled)
70% of Vdd Minimum or No Connection to Enable Spread Spectrum-On Output, 30% of Vdd Maximum to
Disable Spread Spectrum-On Output
-2.00% Down Spread
30kHz Minimum, 32kHz Typical, 35kHz Maximum
90pSec Maximum (Cycle to Cycle; Spread Spectrum-On; Fo=133.333M, Vdd=1.8Vdc)
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Supply Voltage
Maximum Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Output Control Function
Spread Spectrum Input Voltage (Vih
and Vil)
Spread Spectrum
Modulation Frequency
Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 3015, Class 2, HBM 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 1 of 5
EMS21HKF-173.000M
OUTPUT WAVEFORM & TIMING DIAGRAM
SPREAD
DISABLE
INPUT
V
IH
V
IL
(Time)
CLOCK
OUTPUT
(Frequency)
Modulated
Non-
Modulated
(Time)
Modulated
CLOCK
OUTPUT
DOWN
SPREAD
(Frequency)
0%
100%
(Time)
Tsson Disable
Tsson Enable
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State or
Power Down or
Spread Disable
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and V
DD
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 3 of 5
EMS21HKF-173.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 4 of 5
EMS21HKF-173.000M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 5 of 5
Analogue and Mixed Signal
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