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3SMBJ5951B-TP-HF

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size280KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

3SMBJ5951B-TP-HF Overview

Zener Diode,

3SMBJ5951B-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Objectid1288121453
Reach Compliance Codenot_compliant
ECCN codeEAR99
compound_id163106574
Diode typeZENER DIODE
JESD-609 codee3
Humidity sensitivity level1
Peak Reflow Temperature (Celsius)260
Terminal surfaceTin (Sn)
Maximum time at peak reflow temperature10
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMBJ5913B
THRU
3SMBJ5956B
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
3.3thru 200 Volt Voltage Range
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
Available On Tape and Reel
Halogen
free available upon request by adding suffix "-HF"
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Mechanical Data
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260
0
C for 10 seconds.
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
Note:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
3.
Forward Current @ 200mA.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
B
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