INTEGRATED CIRCUITS
DATA SHEET
PCF5079
Dual-band power amplifier
controller for GSM, PCN and DCS
Product specification
File under Integrated Circuits, IC17
2001 Nov 21
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
CONTENTS
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
8
9
10
11
12
12.1
12.2
12.3
12.4
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
Pin description
Pin configurations
FUNCTIONAL DESCRIPTION
General
Power-up mode
OP4 (integrator)
Start-up and initial conditions
Home position voltage
End of burst
Considerations for ramp-down
Configurations
Summary of current and voltage definitions
Timing
LIMITING VALUES
ELECTROSTATIC DISCHARGE (ESD)
DC CHARACTERISTICS
OPERATING CHARACTERISTICS
APPLICATION INFORMATION
Ramp control
PA protection against mismatch
Detected voltage measurement
Application examples
13
14
14.1
14.2
14.3
14.4
14.5
15
15.1
15.2
15.2.1
15.2.2
15.2.3
15.2.4
15.2.5
16
17
18
PACKAGE OUTLINES
SOLDERING (TSSOP10)
PCF5079
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
SOLDERING (HVSON10)
Soldering information
PCB design guidelines
Perimeter pad design
Thermal pad and via design
Stencil design for perimeter pads
Stencil design for thermal pads
Stencil thickness
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2001 Nov 21
2
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
1
FEATURES
2
APPLICATIONS
PCF5079
•
Compatible with baseband interface family PCF5073x
•
Two power sensor inputs
•
Temperature compensation of sensor signal
•
Active filter for Digital-to-Analog Converter (DAC) input
•
Power Amplifier (PA) protection against mismatching
•
Bias current source for detector diodes
•
Generation of pre-bias level for PA at start of burst
(home position)
•
Compatible with a wide range of silicon PAs
•
Compatible with multislot class 12
•
Dual output with internal switch
•
Two different transfer functions
•
Possibility to adapt dynamic transfer functions
•
Very small outline package (3
×
3 mm).
4
QUICK REFERENCE DATA
SYMBOL
V
DD
I
DD(tot)
T
amb
PARAMETER
supply voltage
total supply current
ambient temperature
•
Global System for Mobile communication (GSM)
•
Personal Communications Network (PCN) systems.
3
GENERAL DESCRIPTION
This CMOS device integrates an amplifier for the detected
RF voltage from the sensor, an integrator and an active
filter to build a PA control loop for cellular systems with a
small number of passive components.
MIN.
2.5
−
−40
3.6
−
−
TYP.
5.0
10
MAX.
V
mA
°C
UNIT
+85
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PCF5079T/C/1
PCF5079HK/C/1
TSSOP10
HVSON10
DESCRIPTION
plastic thin shrink small outline package; 10 leads; body width 3 mm
plastic, heatsink very thin small outline package; no leads;
10 terminals; body 3
×
3
×
0.90 mm
VERSION
SOT552-1
SOT650-1
2001 Nov 21
3
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
5
BLOCK DIAGRAM
PCF5079
handbook, full pagewidth
RFin
PA
RFout
RFin
PA
RFout
D2
D1
CINT1
CINT2
VINT(N)
S1
C1
6 pF
C4
10 pF
C2
6 pF
OP1
PUOP1
S5
R1
20 kΩ
PUOP4
OP4D
PUG
OP4IN
PUD
2
SFD
SFG
VS2
5
VS1
4
VCD VCG
3
1
Ibias2
Ibias1
30
µA
VDD
30
µA
VDD
PUfilter
C3
16.6 pF
G = 0.3
VDD
10
µA
Vhome
R4
VSS
7
VDAC
6
VSS
10
VDD
S4
S3
BAND GAP
AND CURRENT
REFERENCE
VDD
10
µA
Vprebias
6 kΩ
VDAC
VDD
PUref
OP4
OP4G
PCF5079
PU/PD
phases commands
CONTROL
LOGIC
8
PU
9
BS
MGT325
VSS
AUXDAC3
PCF5073x
Fig.1 Block diagram.
2001 Nov 21
4
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
6
6.1
PINNING
Pin description
SYMBOL
VCG
VINT(N)
VCD
VS1
VS2
V
SS
VDAC
PU
BS
V
DD
Note
1. O = output, I = input, I/O = input/output, A = analog, D = digital, P = power supply and G = ground
6.2
Pin configurations
PIN
1
2
3
4
5
6
7
8
9
10
TYPE
(1)
O and A
I and A
O and A
I/O and A
I/O and A
G
I and A
I and D
I and D
P
DESCRIPTION
PA control voltage output (GSM)
negative integrator input
PA control voltage (DCS)
sensor signal input 1
sensor signal input 2
reference ground
DAC input voltage
power-up input
band selection input
positive supply voltage
PCF5079
handbook, halfpage
VCG
VINT(N)
VCD
VS1
VS2
1
2
3
4
5
MGT326
10 VDD
9
BS
PU
VDAC
VSS
handbook, halfpage
VS2
VS1
VCD
VINT(N)
VCG
5
4
6
7
VSS
VDAC
PU
BS
VDD
PCF5079T
8
7
6
3
PCF5079HK
8
2
1
9
10
MGU268
Fig.2
Pin configuration (top view) for PCF5079T,
pins are numbered counter-clockwise.
Fig.3
Pin configuration (bottom view) for
PCF5079HK, pins are numbered clockwise.
2001 Nov 21
5