BR573D datasheet, PDF - EEWORLD Datasheet

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BR573D: Description32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144; Categorysemiconductor The embedded processor and controller; File Size2MB，441 Pages; ManufacturerFREESCALE (NXP)

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BR573D Overview

32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144

BR573D Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	144
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	5.25 V
Minimum supply/operating voltage	4.75 V
Rated supply voltage	5 V
External data bus width	16
Number of input and output buses	16
Line speed	16.78 MHz
Processing package description	Ceramic, Quad Flat Package-144
EU RoHS regulations	Yes
state	EOL/LIFEBUY
Craftsmanship	HCMOS
packaging shape	SQUARE
Package Size	FLATPACK
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6500 mm
terminal coating	MATTE Tin
Terminal location	Four
Packaging Materials	Ceramic, Metal-SEALED COFIRED
Temperature level	COMMERCIAL
Address bus width	32
Number of digits	32
Maximum FCLK clock frequency	16 MHz
DMA channel	Yes
Microprocessor type	Microcontroller

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Freescale Semiconductor, Inc.

µ MOTOROLA

Freescale Semiconductor, Inc...

MC68340

Integrated Processor with DMA

User’s Manual

©MOTOROLA INC., 1992

For More Information On This Product,

Go to: www.freescale.com

11/2/95

SECTION

Semiconductor, Inc.

Freescale

1: OVERVIEW

UM Rev 1

TABLE OF CONTENTS

Paragraph

Number

Title

Section 1

Device Overview

Page

Number

Freescale Semiconductor, Inc...

1.1

1.1.1

1.1.2

1.2

1.2.1

1.2.2

1.3

1.3.1

1.3.1.1

1.3.1.2

1.3.1.3

1.3.1.4

1.3.1.5

1.3.1.6

1.3.1.7

1.3.2

1.3.3

1.3.4

1.4

1.5

1.6

1.7

M68300 Family..................................................................................................1-2

Organization ..................................................................................................1-3

Advantages....................................................................................................1-3

Central Processor Unit..................................................................................... 1-3

CPU32 ............................................................................................................1-4

Background Debug Mode...........................................................................1-4

On-Chip Peripherals ........................................................................................1-5

System Integration Module.........................................................................1-5

External Bus Interface..............................................................................1-5

System Configuration and Protection...................................................1-6

Clock Synthesizer.....................................................................................1-6

Chip Select and Wait State Generation ...............................................1-6

Interrupt Handling.....................................................................................1-6

Discrete I/O Pins........................................................................................1-6

IEEE 1149.1 Test Access Port................................................................1-7

Direct Memory Access Module...................................................................1-7

Serial Module................................................................................................1-7

Timer Modules...............................................................................................1-8

Power Consumption Management................................................................1-8

Physical ..............................................................................................................1-9

Compact Disc-Interactive ................................................................................1-9

More Information...............................................................................................1-10

Section 2

Signal Descriptions

2.1

2.2

2.2.1

2.2.2

2.3

2.4

2.5

2.6

MOTOROLA

Signal Index.......................................................................................................2-2

Address Bus.......................................................................................................2-4

Address Bus (A23–A0) ................................................................................2-4

Address Bus (A31–A24)..............................................................................2-4

Data Bus (D15–D0)..........................................................................................2-4

Function Codes (FC3–FC0)............................................................................2-5

Chip Selects (CS3–CS0) ................................................................................2-5

Interrupt Request Level (IRQ7,

IRQ6, IRQ5, IRQ3)

...................................2-6

MC68340 USER'S MANUAL

For More Information On This Product,

Go to: www.freescale.com

iii

11/2/95

SECTION 1: OVERVIEW

Freescale Semiconductor, Inc.

UM Rev.1.0

TABLE OF CONTENTS (Continued)

Paragraph

Number

2.7

2.7.1

2.7.2

2.7.3

2.7.4

2.7.5

2.8

2.8.1

2.8.2

2.8.3

2.8.4

2.9

2.9.1

2.9.2

2.9.3

2.10

2.10.1

2.10.2

2.10.3

2.10.4

2.11

2.11.1

2.11.2

2.11.3

2.11.4

2.12

2.12.1

2.12.2

2.12.3

2.13

2.13.1

2.13.2

2.13.3

2.13.4

2.13.5

2.13.6

2.13.7

2.13.8

2.14

2.14.1

2.14.2

2.14.3

Title

Page

Number

Bus Control Signals .........................................................................................2-6

Data and Size Acknowledge (DSACK1,

DSACK0)................................2-6

Address Strobe (AS)....................................................................................2-6

Data Strobe (DS)...........................................................................................2-7

Transfer Size (SIZ1, SIZ0) ..........................................................................2-7

Read/Write (R/W)...........................................................................................2-7

Bus Arbitration Signals....................................................................................2-7

Bus Request (BR)..........................................................................................2-7

Bus Grant (BG)...............................................................................................2-7

Bus Grant Acknowledge (BGACK).............................................................2-7

Read-Modify-Write Cycle (RMC).................................................................2-8

Exception Control Signals ..............................................................................2-8

Reset (RESET)...............................................................................................2-8

Halt (HALT)....................................................................................................2-8

Bus Error (BERR)...........................................................................................2-8

Clock Signals ....................................................................................................2-8

System Clock (CLKOUT)............................................................................2-8

Crystal Oscillator (EXTAL, XTAL)...............................................................2-9

External Filter Capacitor (XFC) ..................................................................2-9

Clock Mode Select (MODCK).....................................................................2-9

Instrumentation and Emulation Signals .......................................................2-9

Instruction Fetch (IFETCH)..........................................................................2-9

Instruction Pipe (IPIPE)...............................................................................2-9

Breakpoint (BKPT)........................................................................................2-10

Freeze (FREEZE)..........................................................................................2-10

DMA Module Signals.......................................................................................2-10

DMA Request (DREQ2,

DREQ1).................................................................2-10

DMA Acknowledge (DACK2,

DACK1)......................................................2-10

DMA Done (DONE2,

DONE1)......................................................................2-10

Serial Module Signals.....................................................................................2-11

Serial Crystal Oscillator (X2, X1) ...............................................................2-11

Serial External Clock Input (SCLK)...........................................................2-11

Receive Data (RxDA, RxDB).......................................................................2-11

Transmit Data (TxDA, TxDB).......................................................................2-11

Clear to Send (CTSA,

CTSB).....................................................................2-11

Request to Send (RTSA,

RTSB)................................................................2-11

Transmitter Ready (T≈RDYA).....................................................................2-11

Receiver Ready (R≈RDYA) .........................................................................2-12

Timer Signals ....................................................................................................2-12

Timer Gate (TGATE2,

TGATE1)................................................................2-12

Timer Input (TIN2, TIN1) ..............................................................................2-12

Timer Output (TOUT2, TOUT1)...................................................................2-12

Freescale Semiconductor, Inc...

MC68340 USER'S MANUAL

For More Information On This Product,

Go to: www.freescale.com

MOTOROLA

BR573D Related Products

	BR573D	AN1063D	BR1114D	BR1407D	M68000PMAD	MC68340D	MC68340UMAD	AN453
Description	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144	32-BIT, 16.78 MHz, MICROCONTROLLER, CQFP144
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	144	144	144	144	144	144	144	144
Maximum operating temperature	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel	70 Cel
Minimum operating temperature	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel	0.0 Cel
Maximum supply/operating voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply/operating voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Rated supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
External data bus width	16	16	16	16	16	16	16	16
Number of input and output buses	16	16	16	16	16	16	16	16
Line speed	16.78 MHz	16.78 MHz	16.78 MHz	16.78 MHz	16.78 MHz	16.78 MHz	16.78 MHz	16.78 MHz
Processing package description	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144	Ceramic, Quad Flat Package-144
EU RoHS regulations	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
state	EOL/LIFEBUY	EOL/LIFEBUY	EOL/LIFEBUY	EOL/LIFEBUY	EOL/LIFEBUY	EOL/LIFEBUY	EOL/LIFEBUY	EOL/LIFEBUY
Craftsmanship	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS
packaging shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Size	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
surface mount	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal spacing	0.6500 mm	0.6500 mm	0.6500 mm	0.6500 mm	0.6500 mm	0.6500 mm	0.6500 mm	0.6500 mm
terminal coating	MATTE Tin	MATTE Tin	MATTE Tin	MATTE Tin	MATTE Tin	MATTE Tin	MATTE Tin	MATTE Tin
Terminal location	Four	Four	Four	Four	Four	Four	Four	Four
Packaging Materials	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED	Ceramic, Metal-SEALED COFIRED
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Address bus width	32	32	32	32	32	32	32	32
Number of digits	32	32	32	32	32	32	32	32
Maximum FCLK clock frequency	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz
DMA channel	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Microprocessor type	Microcontroller	Microcontroller	Microcontroller	Microcontroller	Microcontroller	Microcontroller	Microcontroller	Microcontroller

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