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WS1M32V-20G3C

Description
SRAM Module, 1MX32, 20ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84
Categorystorage    storage   
File Size746KB,7 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS1M32V-20G3C Overview

SRAM Module, 1MX32, 20ns, CMOS, CQFP84, 28 MM, CERAMIC, QFP-84

WS1M32V-20G3C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instruction28 MM, CERAMIC, QFP-84
Contacts84
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time20 ns
Other featuresUSER CONFIGURABLE AS 2M X 16 OR 4M X 8
JESD-30 codeR-CQFP-G84
JESD-609 codee4
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals84
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
WS1M32V-XG3X
PRELIMINARY*
1Mx32 SRAM 3.3V MODULE
FEATURES

Access Times of 17, 20, 25ns

84 lead, 28mm CQFP, (Package 511)

Organized as two banks of 512Kx32, User Configurable as
2Mx16 or 4Mx8

Commercial, Industrial and Military Temperature Ranges

TTL Compatible Inputs and Outputs

3.3V Power Supply

Low Power CMOS

Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation

Weight - WS1M32V-XG3X - 20 grams typical
*This product is under development, is not qualified or characterized and is subject to change without
notice.
PIN CONFIGURATION FOR WS1M32V-XG3X
I/O0-31
A0-18
WE#1-4
CS#1-2
OE#1-4
V
CC
GND
NC
PIN DESCRIPTION
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enables
+3.3V Power Supply
Ground
Not Connected
TOP VIEW
GND
I/O
31
I/O
30
I/O
29
I/O
28
I/O
27
I/O
26
I/O
25
I/O
24
NC
NC
NC
I/O
23
I/O
22
I/O
21
I/O
20
I/O
19
I/O
18
I/O
17
I/O
16
V
CC
11
10
9
8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
V
CC
A
0
A
1
A
2
A
3
A
4
A
5
A
6
OE#
1
OE#
2
OE#
3
OE#
4
NC
A
7
A
8
A
9
A
10
A
11
A
12
A
13
GND
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34 35 36
37
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
GND
NC
NC
NC
NC
NC
NC
NC
NC
WE#
4
WE#
3
WE#
2
WE#
1
NC
NC
A
18
A
17
A
16
A
15
A
14
V
CC
BLOCK DIAGRAM
OE#1 WE#1
OE#2 WE#2
OE#3 WE#3
OE#4 WE#4
CS#1
A0-18
2M
8
512K x
x 8
512K x 8
2M
8
512K x
x 8
512K x 8
2M
8
512K x
x 8
2M
512K
x 8
512K x 8
512K x 8
V
CC
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CS#
1
NC
CS#
2
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
GND
8
CS#2
I/O0-7
8
8
8
I/O8-15
I/O16-23
I/O24-31
Note: CS#1& CS#2 are used as bank select
The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead CQFJ or 84
PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form.
1.146"
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2011
Rev. 6
© 2011 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.whiteedc.com
www.microsemi.com
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