Multifunction Peripheral, CMOS, CQCC68, CERAMIC, LDCC-68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Waferscale Integration Inc. |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | unknown |
| Maximum access time | 7e-8 ns |
| Other features | 16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD |
| Address bus width | 16 |
| boundary scan | NO |
| Bus compatibility | 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340 |
| maximum clock frequency | 36 MHz |
| External data bus width | 8 |
| JESD-30 code | S-GQCC-J68 |
| JESD-609 code | e0 |
| Number of I/O lines | 40 |
| Number of terminals | 68 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 1024 |
| ROM size (bits) | 256 Bits |
| Maximum standby current | 0.00002 A |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| UV erasable | Y |
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