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CAT35C108K-TE13

Description
EEPROM, 512X16, Serial, CMOS, PDSO8
Categorystorage    storage   
File Size249KB,7 Pages
ManufacturerCatalyst
Websitehttp://www.catalyst-semiconductor.com/
Download Datasheet Parametric Compare View All

CAT35C108K-TE13 Overview

EEPROM, 512X16, Serial, CMOS, PDSO8

CAT35C108K-TE13 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCatalyst
Objectid101089949
package instructionSOP, SOP8,.3
Reach Compliance Codeunknown
compound_id181462431
Spare memory width8
Data retention time - minimum100
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee0
memory density8192 bit
Memory IC TypeEEPROM
memory width16
Number of terminals8
word count512 words
character code512
Maximum operating temperature70 °C
Minimum operating temperature
organize512X16
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
power supply5 V
Certification statusNot Qualified
Serial bus typeMICROWIRE
Maximum standby current0.00001 A
Maximum slew rate0.003 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
write protectHARDWARE/SOFTWARE

CAT35C108K-TE13 Related Products

CAT35C108K-TE13 CAT35C108SI-TE7 CAT35C108P CAT35C108PI CAT35C108SI-TE13 CAT35C108S-TE13 CAT35C108KI-TE13
Description EEPROM, 512X16, Serial, CMOS, PDSO8 EEPROM, 512X16, Serial, CMOS, PDSO8 EEPROM, 1KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 EEPROM, 1KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 EEPROM, 512X16, Serial, CMOS, PDSO8 EEPROM, 512X16, Serial, CMOS, PDSO8 EEPROM, 512X16, Serial, CMOS, PDSO8
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Catalyst Catalyst Catalyst Catalyst Catalyst Catalyst Catalyst
package instruction SOP, SOP8,.3 SOP, SOP8,.25 DIP, DIP8,.3 DIP, DIP8,.3 SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
Spare memory width 8 8 16 16 8 8 8
Data retention time - minimum 100 100 100 100 100 100 100
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e0 e0 e0 e0 e0 e0 e0
memory density 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 16 16 8 8 16 16 16
Number of terminals 8 8 8 8 8 8 8
word count 512 words 512 words 1024 words 1024 words 512 words 512 words 512 words
character code 512 512 1000 1000 512 512 512
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 85 °C 70 °C 85 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C - -40 °C
organize 512X16 512X16 1KX8 1KX8 512X16 512X16 512X16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP DIP DIP SOP SOP SOP
Encapsulate equivalent code SOP8,.3 SOP8,.25 DIP8,.3 DIP8,.3 SOP8,.25 SOP8,.25 SOP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type MICROWIRE MICROWIRE 3-WIRE 3-WIRE MICROWIRE MICROWIRE MICROWIRE
Maximum standby current 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.003 mA 0.004 mA 0.003 mA 0.004 mA 0.004 mA 0.003 mA 0.004 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches - 1 1 1 1 - -
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